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Title: Direct cooled power electronics substrate

Abstract

The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Inventors:
 [1];  [2];  [3];  [4]
  1. Powell, TN
  2. Oak Ridge, TN
  3. Kingston, TN
  4. Knoxville, TN
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1014717
Patent Number(s):
7,796,388
Application Number:
US Patent Application 12/400,081
Assignee:
UT-Battelle, LLC (Oak Ridge, TN) ORO
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Wiles, Randy H, Wereszczak, Andrew A, Ayers, Curtis W, and Lowe, Kirk T. Direct cooled power electronics substrate. United States: N. p., 2010. Web.
Wiles, Randy H, Wereszczak, Andrew A, Ayers, Curtis W, & Lowe, Kirk T. Direct cooled power electronics substrate. United States.
Wiles, Randy H, Wereszczak, Andrew A, Ayers, Curtis W, and Lowe, Kirk T. Tue . "Direct cooled power electronics substrate". United States. doi:. https://www.osti.gov/servlets/purl/1014717.
@article{osti_1014717,
title = {Direct cooled power electronics substrate},
author = {Wiles, Randy H and Wereszczak, Andrew A and Ayers, Curtis W and Lowe, Kirk T},
abstractNote = {The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Sep 14 00:00:00 EDT 2010},
month = {Tue Sep 14 00:00:00 EDT 2010}
}

Patent:

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