ECR plasma-assisted deposition of Al{sub 2}O{sub 3} and dispersion-strengthened AlO{sub 2}
Conference
·
OSTI ID:10123197
Electron cyclotron resonance (ECR) O{sub 2} plasmas, in conjunction with electron-beam evaporation of Al, were used to grow thick AlO{sub x} films were varying but controlled composition and microstructure. The ion energy was varied from 30 to 190 eV, and growth temperatures varied from 35{degrees}C to 400{degrees}C. The ECR-film compositions were varied from AlO{sub 0.1} to Al{sub 2}O{sub 3} by controlling the plasma parameters and Al deposition rate. The Al-rich alloys exhibited a fine-grain (10-100 nm) fcc Al microstructure with {gamma}-Al{sub 2}O{sub 3} precipitates ({approximately}1 nm), similar to that found in the gigapascal-strength O-implanted Al. The measured hardness of the ECR Al-O alloys ({approximately}3 GPa) was also similar to the ion-implanted alloys which implies that the yield strength of the ECR material is {approximately}1 GPa. Moreover, the Al-O alloys retain much of the elasticity of the Al metal matrix. As-deposited stoichiometric Al{sub 2}O{sub 3} samples grown with an applied bias of -140 to -160 V at 400{degrees}C were fine-grain polycrystalline {gamma}-Al{sub 2}O{sub 3}. The amorphous films crystallized into the {gamma}-Al{sub 2}O{sub 3} phase upon vacuum annealing to 800{degrees}C.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 10123197
- Report Number(s):
- SAND--94-2417C; CONF-950220--3; ON: DE95007743
- Country of Publication:
- United States
- Language:
- English
Similar Records
Surface morphology and microstructure of Al-O alloys grown by ECR plasma deposition
Low-energy deposition of high-strength Al(0) alloys from an ECR plasma
Further characterization of the aluminum peroxide oxide, AlO{sub 2}, formed by interfacial reaction between Pt and {alpha}-Al{sub 2}O{sub 3}
Conference
·
Sat Dec 30 23:00:00 EST 1995
·
OSTI ID:188933
Low-energy deposition of high-strength Al(0) alloys from an ECR plasma
Conference
·
Sat Dec 30 23:00:00 EST 1995
·
OSTI ID:192546
Further characterization of the aluminum peroxide oxide, AlO{sub 2}, formed by interfacial reaction between Pt and {alpha}-Al{sub 2}O{sub 3}
Journal Article
·
Mon May 01 00:00:00 EDT 1995
· Acta Metallurgica et Materialia
·
OSTI ID:55340
Related Subjects
36 MATERIALS SCIENCE
360201
360202
360203
665300
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALUMINIUM OXIDES
DIELECTRIC MATERIALS
ELASTICITY
ELECTRON CYCLOTRON-RESONANCE
ENERGY BEAM DEPOSITION
ENERGY BEAM DEPOSITION FILMS
GRAIN ORIENTATION
GRAIN SIZE
HARDNESS
INTERACTIONS BETWEEN BEAMS AND CONDENSED MATTER
ION IMPLANTATION
LANGMUIR PROBE
MECHANICAL PROPERTIES
MICROSTRUCTURE
PHYSICAL PROPERTIES
PREPARATION AND FABRICATION
STRUCTURE AND PHASE STUDIES
YIELD STRENGTH
360201
360202
360203
665300
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALUMINIUM OXIDES
DIELECTRIC MATERIALS
ELASTICITY
ELECTRON CYCLOTRON-RESONANCE
ENERGY BEAM DEPOSITION
ENERGY BEAM DEPOSITION FILMS
GRAIN ORIENTATION
GRAIN SIZE
HARDNESS
INTERACTIONS BETWEEN BEAMS AND CONDENSED MATTER
ION IMPLANTATION
LANGMUIR PROBE
MECHANICAL PROPERTIES
MICROSTRUCTURE
PHYSICAL PROPERTIES
PREPARATION AND FABRICATION
STRUCTURE AND PHASE STUDIES
YIELD STRENGTH