Thermal stability and adhesion of low-emissivity electroplated Au coatings.
We are developing a low-emissivity thermal management coating system to minimize radiative heat losses under a high-vacuum environment. Good adhesion, low outgassing, and good thermal stability of the coating material are essential elements for a long-life, reliable thermal management device. The system of electroplated Au coating on the adhesion-enhancing Wood's Ni strike and 304L substrate was selected due to its low emissivity and low surface chemical reactivity. The physical and chemical properties, interface bonding, thermal aging, and compatibility of the above Au/Ni/304L system were examined extensively. The study shows that the as-plated electroplated Au and Ni samples contain submicron columnar grains, stringers of nanopores, and/or H{sub 2} gas bubbles, as expected. The grain structure of Au and Ni are thermally stable up to 250 C for 63 days. The interface bonding is strong, which can be attributed to good mechanical locking among the Au, the 304L, and the porous Ni strike. However, thermal instability of the nanopore structure (i.e., pore coalescence and coarsening due to vacancy and/or entrapped gaseous phase diffusion) and Ni diffusion were observed. In addition, the study also found that prebaking 304L in the furnace at {ge} 1 x 10{sup -4} Torr promotes surface Cr-oxides on the 304L surface, which reduces the effectiveness of the intended H-removal. The extent of the pore coalescence and coarsening and their effect on the long-term system integrity and outgassing are yet to be understood. Mitigating system outgassing and improving Au adhesion require a further understanding of the process-structure-system performance relationships within the electroplated Au/Ni/304L system.
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1011664
- Report Number(s):
- SAND2010-8704
- Country of Publication:
- United States
- Language:
- English
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