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Fundamentals and application of materials integration for low-power piezoelectrically actuated ultra-nanocrystalline diamond MEMS/NEMS.

Conference ·
DOI:https://doi.org/10.1117/12.822798· OSTI ID:1010893

Most current micro/nanoelectromechanical systems (MEMS/NEMS) are based on silicon. However, silicon exhibits relatively poor mechanical/tribological properties, compromising applications to several projected MEMS/NEMS devices, particularly those that require materials with high Young's modulus for MEMS resonators or low surface adhesion forces for MEMS/NEMS working in conditions with extensive surface contact. Diamond films with superior mechanical/tribological properties provide an excellent alternative platform material. Ultrananocrystalline diamond (UNCD{cflx W}) in film form with 2-5 nm grains exhibits excellent properties for high-performance MEMS/NEMS devices. Concurrently, piezoelectric Pb(Zr{sub x}Ti{sub 1-x})O{sub 3} (PZT) films provide high sensitivity/low electrical noise for sensing/high-force actuation at relatively low voltages. Therefore, integration of PZT and UNCD films provides a high-performance platform for advanced MEMS/NEMS devices. This paper describes the bases of such integration and demonstration of low voltage piezoactuated hybrid PZT/UNCD cantilevers.

Research Organization:
Argonne National Laboratory (ANL)
Sponsoring Organization:
SC
DOE Contract Number:
AC02-06CH11357
OSTI ID:
1010893
Report Number(s):
ANL/MSD/CP-64125
Country of Publication:
United States
Language:
ENGLISH