Experimental determination of the Cu-In-Pb ternary phase diagram
- Wisconsin Univ., Madison, WI (United States). Dept. of Materials Science and Engineering
- Sandia National Labs., Albuquerque, NM (United States)
Use of lead-indium solders in microelectronics packaging has increased over the last decade. Increased usage is due to improved properties, such as greater thermo-mechanical fatigue resistance, lower intermetallic formation rates with base metallizations, such as copper, and lower reflow temperatures. However, search of literature reveals no comprehensive studies on phase equilibrium relations between copper metal and lead-indium solder. Our effort involves a combination of experimental data acquisition and computer modeling to obtain the Cu-In-Pb ternary phase diagram. Isotherms and isopleths of interest at low temperatures are achieved by means of differential scanning calorimetry and electron probe microanalysis. Thermodynamic models of these sections served as a guide for efficient experimentation.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 10106690
- Report Number(s):
- SAND--93-2736C; CONF-9310224--1; ON: DE94003765; BR: GB0103012
- Country of Publication:
- United States
- Language:
- English
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