Particle transport in plasma reactors

Conference · Sun Jan 01 04:00:00 EST 1995

OSTI ID:10106633

Rader, D J; Geller, A S; Choi, Seung J ^[1]; Kushner, M J ^[2]

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1. Sandia National Labs., Albuquerque, NM (United States)
2. Illinois Univ., Urbana, IL (United States)

SEMATECH and the Department of Energy have established a Contamination Free Manufacturing Research Center (CFMRC) located at Sandia National Laboratories. One of the programs underway at the CFMRC is directed towards defect reduction in semiconductor process reactors by the application of computational modeling. The goal is to use fluid, thermal, plasma, and particle transport models to identify process conditions and tool designs that reduce the deposition rate of particles on wafers. The program is directed toward defect reduction in specific manufacturing tools, although some model development is undertaken when needed. The need to produce quantifiable improvements in tool defect performance requires the close cooperation among Sandia, universities, SEMATECH, SEMATECH member companies, and equipment manufacturers. Currently, both plasma (e.g., etch, PECVD) and nonplasma tools (e.g., LPCVD, rinse tanks) are being worked on under this program. In this paper the authors summarize their recent efforts to reduce particle deposition on wafers during plasma-based semiconductor manufacturing.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 10106633
• Report Number(s): SAND--94-2944C; CONF-9410132--4; ON: DE95004541
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360601
42 ENGINEERING
420000
COORDINATED RESEARCH PROGRAMS
DEFECTS
ENGINEERING
INDUSTRY
MANUFACTURING
NATIONAL GOVERNMENT
PREPARATION AND MANUFACTURE
SEMICONDUCTOR DEVICES
SURFACE CONTAMINATION