Method for rapid, controllable growth and thickness, of epitaxial silicon films
Patent
·
OSTI ID:1001799
- Littleton, CO
- Golden, CO
- Boulder, CO
A method of producing epitaxial silicon films on a c-Si wafer substrate using hot wire chemical vapor deposition by controlling the rate of silicon deposition in a temperature range that spans the transition from a monohydride to a hydrogen free silicon surface in a vacuum, to obtain phase-pure epitaxial silicon film of increased thickness is disclosed. The method includes placing a c-Si substrate in a HWCVD reactor chamber. The method also includes supplying a gas containing silicon at a sufficient rate into the reaction chamber to interact with the substrate to deposit a layer containing silicon thereon at a predefined growth rate to obtain phase-pure epitaxial silicon film of increased thickness.
- Research Organization:
- Midwest Research Institute
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC36-99GO10337;
- Assignee:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- Patent Number(s):
- 7,601,215
- Application Number:
- 11/560,886
- OSTI ID:
- 1001799
- Country of Publication:
- United States
- Language:
- English
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