Transient-Liquid-Phase and Liquid-Film-Assisted Joining ofCeramics

Journal Article · Wed Feb 09 00:00:00 EST 2005 · Journal of the European Ceramic Society

OSTI ID:877675

Sugar, Joshua D; McKeown, Joseph T; Akashi, Takaya; Hong, SungM; Nakashima, Kunihiko; Glaeser, Andreas M

Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point (<450 C) liquids and commercial reactive-metal brazes is described. Recent LFAJ work on joining alumina to niobium using copper films is presented.

• Research Organization: Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
• Sponsoring Organization: USDOE Director. Office of Science. Office of Basic EnergySciences. Materials Sciences and Engineering Division; Japanese Ministryof Education Culture Sports Science and Technology, Jane LewisFellowship, Japan Society for the Promotionof Science for an InvitationFellowship for Research in Japan
• DOE Contract Number: DE-AC02-05CH11231
• OSTI ID: 877675
• Report Number(s): LBNL-57042; JECSER; R&D Project: 512703; BnR: KC0201030; TRN: US200607%%422
• Journal Information: Journal of the European Ceramic Society, Vol. 26, Issue 4-5; Related Information: Journal Publication Date: 2006; ISSN 0955-2219
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CERAMICS
COPPER
NIOBIUM