Processing of alumina-niobium interfaces via liquid-film-assistedjoining
Alumina-niobium interfaces were fabricated at 1400 C via solid-state diffusion brazing of a 127-{micro}m-thick niobium foil between alumina blocks. Prior to brazing, some of the alumina mating surfaces, both polished and unpolished, were evaporation-coated with copper films {approx}1.4 {micro}m, {approx}3.0 {micro}m, and {approx}5.5 {micro}m thick to induce liquid-film-assisted joining at the brazing temperature. The effects of copper film thickness and surface roughness on fracture characteristics and ceramic-metal interfacial microstructure were investigated by room-temperature four-point bend tests, optical microscopy, profilometry, and atomic force microscopy. The average strength of bonds between niobium and polished alumina substrates increased with the introduction of copper film interlayers, and the scatter in strength tended to decrease, with an optimum combination of strength and Weibull modulus arising for a copper film thickness of 3.0 {micro}m. The strength characteristics of niobium bonded to unpolished alumina substrates were also improved by liquid-film-assisted joining, but were unaffected by the thickness of the copper interlayers.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Director. Office of Science. Office of Basic EnergySciences. Materials Sciences and Engineering Division
- DOE Contract Number:
- DE-AC02-05CH11231
- OSTI ID:
- 877320
- Report Number(s):
- LBNL-55738; R&D Project: 512703; BnR: KC0201030; TRN: US200607%%374
- Journal Information:
- Welding Journal, Vol. 84, Issue 3; Related Information: Journal Publication Date: 03/2005
- Country of Publication:
- United States
- Language:
- English
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