Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds

Cockeram, Brian V.

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Title: Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds

Abstract

An exemplary method of bonding of silicon carbide and objects having a hermetic silicon carbide-iridium-silicon carbide bond. The method includes the steps of inserting an iridium foil between two SiC layers; heating the iridium foil and SiC layers at a temperature of 1500 C in a vacuum of <10−5 ton; applying a pressure between 1 ksi and 7 ksi to the iridium foil and SiC layers; maintaining the temperature and pressure for 6-10 hours; and forming a hermetic seal having a leak rate <3×10−9 cm3/sec between the iridium foil and the two SiC layers. The SiC-iridium bonds lack cracks and are hermetic.

Inventors:: Cockeram, Brian V.

Issue Date:: Tue Sep 10 00:00:00 EDT 2019

Research Org.:: Bettis Atomic Power Laboratory (BAPL), West Mifflin, PA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1576325

Patent Number(s):: 10406774

Application Number:: 15/417,293

Assignee:: U.S. Department of Energy (Washington, DC)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

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B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K1/0008 - {specially adapted for particular articles or work}
B23K2101/04 - Tubular or hollow articles
B23K2103/52 - {Ceramics}

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
B32B1/08 - Tubular products
B32B15/04 - comprising metal as the main or only constituent of a layer, {which is next to another layer of the same or of a different material
B32B2250/03 - 3 layers
B32B2250/40 - Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
B32B2307/306 - Resistant to heat
B32B2307/50 - having particular mechanical properties
B32B2307/732 - Dimensional properties
B32B2309/02 - Temperature
B32B2309/04 - Time
B32B2309/105 - Thickness
B32B2309/12 - Pressure
B32B2309/68 - Vacuum
B32B37/10 - characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
B32B7/04 - Interconnection of layers
B32B9/005 - {comprising one layer of ceramic material, e.g. porcelain, ceramic tile
B32B9/041 - {of metal}

Show less

DOE Contract Number:: AC11-98PN38206

Resource Type:: Patent

Resource Relation:: Patent File Date: 2017 Jan 27

Country of Publication:: United States

Language:: English

Citation Formats


                    Cockeram, Brian V. Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds.  United States: N. p., 2019. 
        Web.

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                    Cockeram, Brian V. Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds.  United States.

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                    Cockeram, Brian V. Tue .  
        "Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds".  United States.  https://www.osti.gov/servlets/purl/1576325.

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@article{osti_1576325,

  title        = {Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds},

  author       = {Cockeram, Brian V.},

  abstractNote = {An exemplary method of bonding of silicon carbide and objects having a hermetic silicon carbide-iridium-silicon carbide bond. The method includes the steps of inserting an iridium foil between two SiC layers; heating the iridium foil and SiC layers at a temperature of 1500 C in a vacuum of <10−5 ton; applying a pressure between 1 ksi and 7 ksi to the iridium foil and SiC layers; maintaining the temperature and pressure for 6-10 hours; and forming a hermetic seal having a leak rate <3×10−9 cm3/sec between the iridium foil and the two SiC layers. The SiC-iridium bonds lack cracks and are hermetic.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Sep 10 00:00:00 EDT 2019},

  month        = {Tue Sep 10 00:00:00 EDT 2019}

}

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Similar Records

Title: Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds

Abstract

Citation Formats

Method for bonding ceramics to metals patent, November 1986

Joining of materials using laser heating patent, July 2003

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Semiconductor Device and Method of Manufacturing the Same patent-application, July 2004

Screen-Printed Capacitors for Filter Feedthrough Assemblies patent-application, March 2007

Magnetic resonance imaging coated assembly patent, July 2004

Integral cap for electrode and electrode employing same patent, July 1992

Ceramics bonded product and method of producing the same patent, June 1992

Energy enhanced process for treating a conductive surface and products formed thereby patent, July 2003

Brazing fixtures and methods for fabricating brazing fixtures used for making feed-through assemblies patent, August 2005

Fabrication Methods and Structures for Micro-Reservoir Devices patent-application, May 2006

Microelectromechanical systems using thermocompression bonding patent, February 2005

Laser bonding process patent, April 1996

Pulsed electron beam joining of materials patent, February 1997

Package for an Implantable Medical Device patent-application, March 2002

Ceramic to Metal Seal patent, July 1971

High-Density Array of Micro-Machined Electrodes for Neural Stimulation patent-application, October 2003

Honeycomb Composite Silicon Carbide Mirrors and Structures patent-application, September 2011

Lead-In Conductor for Electrical Devices patent, November 1971

High-density array of micro-machined electrodes for neural stimulation patent, March 2010

Screen-printed filter capacitors for filtered feedthroughs patent, August 2009

Method for Coating Parts Made of Material Based on SIC, Coating Compositions, and Resulting Coated Parts patent-application, January 2003

Thermocouple Probe patent, December 1963

Silicon carbide composite with coated fiber reinforcement patent, September 1996

Method for Assembling, by Brazing, a Substrate Comprising Pyrocarbon with Parts Comprising Pyrocarbon patent-application, June 2015

Protective coating with reactive interlayer on reinforcement in silicon carbide composite patent, March 1994

Method of fabricating an interconnection element patent, January 2002

Monocrystalline Diamond Layer and Method for the Production Thereof patent-application, April 2007

Metallic Bond patent, October 1958

Fabrication methods and structures for micro-reservoir devices patent, August 2008

Electrode array for neural stimulation patent, July 2006

Methods for Forming Copper Interconnect Structures by Co-Plating of Noble Metals and Structures Formed Thereby patent-application, June 2004

Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits patent, April 2019

Resilient contact structures for interconnecting electronic devices patent, August 2004

Package for an implantable medical device patent, August 2007

Metal-Ceramic Laminated Skin Surface patent, April 1962

Method for bonding ceramics to metals
patent, November 1986

Joining of materials using laser heating
patent, July 2003

Fabrication of metal and ceramic matrix composites
patent, May 1993

Semiconductor Device and Method of Manufacturing the Same
patent-application, July 2004

Screen-Printed Capacitors for Filter Feedthrough Assemblies
patent-application, March 2007

Magnetic resonance imaging coated assembly
patent, July 2004

Integral cap for electrode and electrode employing same
patent, July 1992

Ceramics bonded product and method of producing the same
patent, June 1992

Energy enhanced process for treating a conductive surface and products formed thereby
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patent, August 2005

Fabrication Methods and Structures for Micro-Reservoir Devices
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Microelectromechanical systems using thermocompression bonding
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Package for an Implantable Medical Device
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High-Density Array of Micro-Machined Electrodes for Neural Stimulation
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Honeycomb Composite Silicon Carbide Mirrors and Structures
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Lead-In Conductor for Electrical Devices
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