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Title: Yield Stress Reduction of Radioactive Waste Slurries by Addition of Surfactants

Conference ·
OSTI ID:837899

The Savannah River Site (SRS) and Hanford site are in the process of stabilizing millions of gallons of radioactive waste slurries remaining from production of nuclear materials for the Department of Energy (DOE). The Defense Waste Processing Facility (DWPF) at SRS is currently vitrifying the waste in borosilicate glass while the facilities at the Hanford site are in the design/construction phase. Both processes utilize slurry-fed joule heated melters to vitrify the waste slurries. The rheological properties of the waste slurries limit the total solids content that can be processed by the remote equipment during the pretreatment and melter feed processes. The use of a surface active agent, or surfactant, to increase the solids loading that can be fed to the melters would increase melt rate by reducing the heat load on the melter required to evaporate the water in the feed. The waste slurries are non-Newtonian fluids with rheological properties that were modeled using the Bingham Plastic mod el (this model is typically used by SRNL when studying the DWPF process1).The results illustrate that altering the surface chemistry of the particulates in the waste slurries can lead to a reduction in the yield stress. Dolapix CE64 is an effective surfactant over a wide range of pH values and was effective for all simulants tested. The effectiveness of the additive increased in DWPF simulants as the concentration of the additive was increased. No maxi main effectiveness was observed. Particle size measurements indicate that the additive acted as a flocculant in the DWPF samples and as a dispersant in the RPP samples.

Research Organization:
Savannah River Site (SRS), Aiken, SC (United States)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
AC09-96SR18500
OSTI ID:
837899
Report Number(s):
WSRC-MS-2005-00097; TRN: US0501176
Resource Relation:
Conference: AICHE Spring Meeting, Atlanta, GA (US), 04/10/2005--04/14/2005; Other Information: PBD: 8 Feb 2005
Country of Publication:
United States
Language:
English