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Title: Cooling apparatus with a resilient heat conducting member

Patent ·
OSTI ID:1257183

A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0002894
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
Patent Number(s):
9,370,122
Application Number:
13/738,961
OSTI ID:
1257183
Resource Relation:
Patent File Date: 2013 Jan 10
Country of Publication:
United States
Language:
English

References (32)

Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers
  • David, Milnes P.; Iyengar, Madhusudan; Parida, Pritish
  • 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) https://doi.org/10.1109/STHERM.2012.6188853
conference March 2012
Server liquid cooling with chiller-less data center design to enable significant energy savings
  • Iyengar, Madhusudan; David, Milnes; Parida, Pritish
  • 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) https://doi.org/10.1109/STHERM.2012.6188851
conference March 2012
Unitary heat-dissipating fin strip unit with straight strip portions and U-shaped strip portions patent September 2002
Heat dissipating device for dissipating heat generated by a disk drive module inside a computer housing patent May 2004
Memory heat-dissipating device patent May 2007
Compliant thermal interface structure with vapor chamber patent September 2007
Compliant thermal interface structure utilizing spring elements patent April 2008
Cooling structure using rigid movable elements patent April 2008
Display module patent April 2008
Hybrid cooling system for a multi-component electronics system patent July 2008
Compliant thermal interface structure utilizing spring elements with fins patent August 2008
Compliant thermal interface structure utilizing spring elements patent June 2009
Cooling structure using rigid movable elements patent June 2009
Conductive heat transport cooling system and method for a multi-component electronics system patent December 2009
Heat transfer mechanism, heat dissipation system, and communication apparatus patent February 2010
Liquid cooling system patent March 2011
Fin-type heat sink and electronic device using same patent March 2011
High performance dual-in-line memory (DIMM) array liquid cooling assembly and method patent June 2011
Heat sink and electronic device using same patent August 2011
Heat radiator patent August 2011
Liquid-cooled electronics apparatus and methods of fabrication patent September 2011
Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages patent December 2011
Printed circuit board cooling assembly patent December 2013
Liquid-cooled memory system having one cooling pipe per pair of DIMMs patent February 2014
Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) patent December 2014
Liquid DIMM Cooler patent-application November 2006
Heat dissipating assembly patent-application June 2007
Folded-Sheet-Metal Heatsinks for Closely Packaged Heat-Producing Devices patent-application May 2008
Conductive Heat Transport Cooling System and Method for a Multi-Component Electronics System patent-application October 2008
Liquid-Cooled Electronics Apparatus And Methods Of Fabrication patent-application March 2011
Liquid DIMM Cooling Device patent-application January 2013
Method, Apparatus, and System for Dissipating Heat of Memory with Liquid Cooling patent-application December 2013

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