Residual stress within nanoscale metallic multilayer systems during thermal cycling

Economy, David Ross; Cordill, Megan Jo; Payzant, E. Andrew; Kennedy, Marian S.

doi:10.1016/j.msea.2015.09.082

Title: Residual stress within nanoscale metallic multilayer systems during thermal cycling

Journal Article · Mon Sep 21 00:00:00 EDT 2015 · Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing

DOI:https://doi.org/10.1016/j.msea.2015.09.082· OSTI ID:1221731

Economy, David Ross ^[1]; Cordill, Megan Jo ^[2]; Payzant, E. Andrew ^[3]; Kennedy, Marian S. ^[1]

Clemson Univ., Clemson, SC (United States)
Austrian Academy of Sciences and Dept. of Materialphysik, Montanuniversitaet Leoben, Leoben (Austria)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Projected applications for nanoscale metallic multilayers will include wide temperature ranges. Since film residual stress has been known to alter system reliability, stress development within new film structures with high interfacial densities should be characterized to identify potential long-term performance barriers. To understand factors contributing to thermal stress evolution within nanoscale metallic multilayers, stress in Cu/Nb systems adhered to Si substrates was calculated from curvature measurements collected during cycling between 25 °C and 400 °C. Additionally, stress within each type of component layers was calculated from shifts in the primary peak position from in-situ heated X-ray diffraction. The effects of both film architecture (layer thickness) and layer order in metallic multilayers were tracked and compared with monolithic Cu and Nb films. Analysis indicated that the thermoelastic slope of nanoscale metallic multilayer films depends on thermal expansion mismatch, elastic modulus of the components, and also interfacial density. The layer thickness (i.e. interfacial density) affected thermoelastic slope magnitude while layer order had minimal impact on stress responses after the initial thermal cycle. When comparing stress responses of monolithic Cu and Nb films to those of the Cu/Nb systems, the nanoscale metallic multilayers show a similar increase in stress above 200 °C to the Nb monolithic films, indicating that Nb components play a larger role in stress development than Cu. Local stress calculations from X-ray diffraction peak shifts collected during heating reveal that the component layers within a multilayer film respond similarly to their monolithic counterparts.

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Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

Sponsoring Organization:: USDOE Office of Science (SC)

Grant/Contract Number:: AC05-00OR22725

OSTI ID:: 1221731

Journal Information:: Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing, Vol. 648; Conference: San Jose, California United States, 8-13 June 2014; ISSN 0921-5093

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 5 works

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Title: Residual stress within nanoscale metallic multilayer systems during thermal cycling

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