Metallography of solid state bonds
Abstract
Two methods of bonding dissimilar metals have been described: silver-assisted solid state bonding and friction welding. Both methods can produce bonds that are very strong at room temperature with ultimate strengths greater than the lower strength metal. Two distinct types of defects have been observed in friction welds between 1100 aluminum and 316 stainless steel: voids or tearing at the bond interface and formation of brittle intermetallic. Silver-assisted solid state bonds have been made that have very high ultimate strengths. This process requires a large amount of handling of the piece parts prior to being bonded, with the chance for contamination or damage. There are numerous metallurgical problems in the silver-assisted solid state bonding technique. The types of surface preparation method should be considered. In the case of 1100 aluminum bonded to 316 stainless steel, as-machined surfaces are adequate. There is a definite relationship between silver microstructure and substrate temperature. The microstructures produced have significant differences in hardness and ductility. A change in microstructure does not appear to have any effect on the resulting bond strength. Optimum bonding parameters are needed to produce high strength bonds. Low bonding pressure and/or temperature can result in low strength failures. High bonding temperaturesmore »
- Authors:
- Publication Date:
- Research Org.:
- Rockwell International Corp., Golden, CO (USA). Rocky Flats Plant
- OSTI Identifier:
- 5566160
- Report Number(s):
- RFP-3847; CONF-850753-
ON: DE85014564
- DOE Contract Number:
- AC04-76DP03533
- Resource Type:
- Conference
- Resource Relation:
- Conference: International Metallographic Society conference, Denver, CO, USA, 21 Jul 1985; Other Information: Microfiche only, copy does not permit paper copy reproduction
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; ALUMINIUM; BONDING; METALLOGRAPHY; FRICTION WELDING; METALS; STAINLESS STEEL-316; FAILURES; JOINING; SCANNING ELECTRON MICROSCOPY; SILVER; ALLOYS; CHROMIUM ALLOYS; CHROMIUM STEELS; CHROMIUM-NICKEL STEELS; CORROSION RESISTANT ALLOYS; ELECTRON MICROSCOPY; ELEMENTS; FABRICATION; HEAT RESISTANT MATERIALS; HEAT RESISTING ALLOYS; IRON ALLOYS; IRON BASE ALLOYS; MATERIALS; MICROSCOPY; MOLYBDENUM ALLOYS; NICKEL ALLOYS; STAINLESS STEELS; STEELS; TRANSITION ELEMENTS; WELDING; 360101* - Metals & Alloys- Preparation & Fabrication
Citation Formats
Johns, W L, and Doyle, J H. Metallography of solid state bonds. United States: N. p., 1985.
Web.
Johns, W L, & Doyle, J H. Metallography of solid state bonds. United States.
Johns, W L, and Doyle, J H. 1985.
"Metallography of solid state bonds". United States.
@article{osti_5566160,
title = {Metallography of solid state bonds},
author = {Johns, W L and Doyle, J H},
abstractNote = {Two methods of bonding dissimilar metals have been described: silver-assisted solid state bonding and friction welding. Both methods can produce bonds that are very strong at room temperature with ultimate strengths greater than the lower strength metal. Two distinct types of defects have been observed in friction welds between 1100 aluminum and 316 stainless steel: voids or tearing at the bond interface and formation of brittle intermetallic. Silver-assisted solid state bonds have been made that have very high ultimate strengths. This process requires a large amount of handling of the piece parts prior to being bonded, with the chance for contamination or damage. There are numerous metallurgical problems in the silver-assisted solid state bonding technique. The types of surface preparation method should be considered. In the case of 1100 aluminum bonded to 316 stainless steel, as-machined surfaces are adequate. There is a definite relationship between silver microstructure and substrate temperature. The microstructures produced have significant differences in hardness and ductility. A change in microstructure does not appear to have any effect on the resulting bond strength. Optimum bonding parameters are needed to produce high strength bonds. Low bonding pressure and/or temperature can result in low strength failures. High bonding temperatures can result in the growth of brittle intermetallics. Metallography is an important tool in studying solid state bonds. Both SEM and optical metallography methods are employed.},
doi = {},
url = {https://www.osti.gov/biblio/5566160},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 01 00:00:00 EST 1985},
month = {Tue Jan 01 00:00:00 EST 1985}
}