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Title: Characterizing performances of solder paste printing process at flexible manufacturing lines

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.
Authors:
;  [1] ;  [2]
  1. University of Science Malaysia, 11800 Minden, Penang (Malaysia)
  2. Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)
Publication Date:
OSTI Identifier:
22390946
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1643; Journal Issue: 1; Conference: 2. ISM International Statistical Conference 2014: Empowering the Applications of Statistical and Mathematical Sciences, Pahang (Malaysia), 12-14 Aug 2014; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; ALGORITHMS; DESIGN; MANUFACTURING; PERFORMANCE; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUITS; STATISTICAL MODELS