Impact of N{sub 2} and forming gas plasma exposure on the growth and interfacial characteristics of Al{sub 2}O{sub 3} on AlGaN
- Department of Materials Science and Engineering, University of Texas at Dallas, Richardson, Texas 75080 (United States)
The interface and atomic layer deposition (ALD) of Al{sub 2}O{sub 3} on the annealed, N{sub 2} plasma and forming gas (N{sub 2}:H{sub 2}) exposed Al{sub 0.25}Ga{sub 0.75}N surface was studied using in situ X-ray photoelectron spectroscopy and low energy ion scattering spectroscopy. Exposure of the Al{sub 0.25}Ga{sub 0.75}N surface to the plasma treatments is able to remove spurious carbon, and readily facilitate uniform ALD Al{sub 2}O{sub 3} nucleation.
- OSTI ID:
- 22217830
- Journal Information:
- Applied Physics Letters, Vol. 103, Issue 22; Other Information: (c) 2013 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
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