An Improvement in Thermal Modelling of Automated Tape Placement Process
- GEM, UMR CNRS-Centrale Nantes 1 rue de la Noe, BP 92101, F-44321 Nantes cedex 3 (France)
- EADS IW, Techno campus EMC2, Allee du Chaffault, 44340 Bouguenais (France)
The thermoplastic tape placement process offers the possibility of manufacturing large laminated composite parts with all kinds of geometries (double curved i.e.). This process is based on the fusion bonding of a thermoplastic tape on a substrate. It has received a growing interest during last years because of its non autoclave abilities.In order to control and optimize the quality of the manufactured part, we need to predict the temperature field throughout the processing of the laminate. In this work, we focus on a thermal modeling of this process which takes in account the imperfect bonding existing between the different layers of the substrate by introducing thermal contact resistance in the model. This study is leaning on experimental results which inform us that the value of the thermal resistance evolves with temperature and pressure applied on the material.
- OSTI ID:
- 21510170
- Journal Information:
- AIP Conference Proceedings, Vol. 1315, Issue 1; Conference: AMPT2010: International conference on advances in materials and processing technologies, Paris (France), 24-27 Oct 2010; Other Information: DOI: 10.1063/1.3552438; (c) 2010 American Institute of Physics; ISSN 0094-243X
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
BONDING
COMPOSITE MATERIALS
LAYERS
MANUFACTURING
SENSORS
SIMULATION
SUBSTRATES
THERMOPLASTICS
WELDING
FABRICATION
JOINING
MATERIALS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
SYNTHETIC MATERIALS