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Title: Development and application of an underfloor air-conditioning system with improved outlets for a ``smart`` building in Tokyo

Conference ·
OSTI ID:211849
;  [1];  [2]
  1. Nikken Sekkei Corp., Tokyo (Japan)
  2. Ochanomizu Univ., Tokyo (Japan). Dept. of Human Environments

An underfloor air-conditioning system was developed and introduced into a high technology ``smart`` building in Tokyo. Experiments and numerical simulation studies were carried out prior to the introduction of the system, to preestimate its thermal comfort and energy saving effects. After the construction of the system, field measurement of the indoor environment and occupant surveys helped assess whether the system actually achieved its anticipated performance. The floor diffuser design was improved to prevent draft and local cooling of feet observed under the high cooling load condition. The results of these studies demonstrated that the indoor environment provided by the underfloor air-conditioning system with the improved type of outlet meets thermal comfort requirements recommended by ASHRAE Standard 55-92 and maintains good indoor air quality (IAQ). Moreover, these studies revealed that, compared with a conventional ceiling diffuser system, the underfloor air-conditioning system not only promotes exhaust heat removal with higher efficiency but also increases the use of natural energy. Possibilities to apply underfloor air-conditioning to task/ambient or personalized systems were also discussed. The studies suggest that the system should be considered as an appropriate choice available for air-conditioning systems in future smart buildings.

OSTI ID:
211849
Report Number(s):
CONF-950624-; TRN: IM9617%%165
Resource Relation:
Conference: Annual meeting of the American Society of Heating, Refrigeration and Air-Conditioning Engineers, Inc. (ASHRAE), San Diego, CA (United States), 24-28 Jun 1995; Other Information: PBD: 1995; Related Information: Is Part Of ASHRAE transactions 1995: Technical and symposium papers. Volume 101, Part 2; PB: 1497 p.
Country of Publication:
United States
Language:
English