The Copper Sulfide Coating on Polyacrylonitrile with Chelating Agents by an Electroless Deposition Method and its EMI Shielding Effectiveness

Journal Article · Thu Aug 28 00:00:00 EDT 2008 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.2989048· OSTI ID:21152517

Roan, M -L ^[1]; Chen, Y -H; Huang, C -Y ^[2]

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1. Department of Electro-optical Engineering, Lan-Yan Institute of Technology, Taiwan (China)
2. Department of Materials Engineering, Tatung University, Taiwan (China)

In this study, a variety of concentrations of chelating agents were added to obtain the anchoring effect and chelating effect in the electroless plating bath. The mechanism of the Cu{sub x(x=1,2)}S growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate residued in PAN substrate would be purged due to the swelling effect by chelating agents solution. And then, the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and the chelating agent. Consequently, the copper sulfide layer deposited by the electroless plating reaction with EDTA and TEA. The swelling degree (S{sub d}) was proposed and evaluated from the FT-IR spectra. The relationship between swelling degree of the PAN films and EDTA (C) is expressed as: S{sub d} = 0.13+0.90xe and (-15.15C). And TEA series is expressed as: S{sub d} = 0.07+1.00xe and (-15.15C). On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 nm to 383 nm when the concentration of EDTA increased from 0.00M to 0.20M. Consequently, the EMI SE of the composites increased from 10{approx}12 dB to 25{approx}27 dB. The GIA-XRD analyze indicated that the deposited layer consisted of CuS and Cu{sub 2}S.

• OSTI ID: 21152517
• Journal Information: AIP Conference Proceedings, Vol. 1042, Issue 1; Conference: 4. international conference on Times Of Polymers (TOP) and composites, Ischia (Italy), 21-24 Sep 2008; Other Information: DOI: 10.1063/1.2989048; (c) 2008 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ABSORPTION SPECTROSCOPY
COMPOSITE MATERIALS
COPPER SULFIDES
EDTA
ELECTRODEPOSITION
FOURIER TRANSFORMATION
INFRARED SPECTRA
INTERFACES
LAYERS
MAGNETIC SHIELDING
NITRILES
ORGANIC POLYMERS
PLATING
SEMICONDUCTOR MATERIALS
SUBSTRATES
SWELLING
THIN FILMS
VINYL ACETATE
X-RAY DIFFRACTION