Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder

Journal Article · Wed Apr 30 00:00:00 EDT 2003 · Materials Research Bulletin

DOI:https://doi.org/10.1016/S0025-5408(03)00024-2· OSTI ID:20884675

Chang, T -C; Hon, M -H; Wang, M -C

The intermetallic compounds (IMCs) formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder alloy have been investigated by X-ray diffraction (XRD), transmission electron microscopy (TEM) and electron diffraction (ED). The XRD patterns show that the main IMCs formed at the interface of Sn-9Zn-0.5Ag/Cu are {gamma}-Cu{sub 5}Zn{sub 8} and {eta}'-Cu{sub 6}Sn{sub 5}. The Ag{sub 3}Sn IMC with orthorhombic structure was also observed at the Sn-9Zn-0.5Ag/Cu interface by TEM and ED analyses. The interfacial adhesion strength between the Cu substrate and Sn-9Zn-0.5Ag lead-free solder alloy is higher than that of the Sn-9Zn alloy due to the formation of Ag{sub 3}Sn IMC at the interface.

• OSTI ID: 20884675
• Journal Information: Materials Research Bulletin, Vol. 38, Issue 5; Other Information: DOI: 10.1016/S0025-5408(03)00024-2; PII: S0025540803000242; Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved; Country of input: International Atomic Energy Agency (IAEA); ISSN 0025-5408
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ELECTRON DIFFRACTION
INTERFACES
INTERMETALLIC COMPOUNDS
LEAD
ORTHORHOMBIC LATTICES
SUBSTRATES
TRANSMISSION ELECTRON MICROSCOPY
X-RAY DIFFRACTION