Package compatibility and substrate dependence of granular soft magnetic material CoFeHfO developed by reactive sputtering
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94305 (United States)
Integration of magnetic passive components into package has been attracting more interests recently, but efficient package-compatible magnetic materials are needed. We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated the substrate dependence of its soft magnetic property. Atomic force microscopy and grazing incidence x-ray-scattering-diffraction spectra show that a rough substrate surface degrades the magnetic property of CoFeHfO thin films with almost the same crystal microstructure. With surface planarization by chemical-mechanical polishing, soft magnetic material CoFeHfO can be realized on the package substrate. This material is promising for future applications in package.
- OSTI ID:
- 20788139
- Journal Information:
- Journal of Applied Physics, Vol. 99, Issue 8; Other Information: DOI: 10.1063/1.2158973; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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