Dislocation dynamics in Ni{sub 3}Al: Experiments and computations
Conference
·
OSTI ID:20001683
A modified electrolytic etchant has been successfully used to observe dislocation etch-pits on {l{underscore}brace}100{r{underscore}brace} surfaces of single crystal Ni{sub 3}Al containing Hf and B additions. Four-point bending tests have been used to obtain the dependence of dislocation velocity on resolved shear stress at room temperature. A comparison with earlier studies reveal that the rate of change of dislocation velocity with resolved shear stress, to a first approximation, is independent of alloying. Atomic level simulations have been performed using the embedded atom method (EAM) to study dislocation core structures and frictional stress in Ni{sub 3}Al.
- Research Organization:
- Brown Univ., Providence, RI (US)
- Sponsoring Organization:
- National Science Foundation (NSF)
- OSTI ID:
- 20001683
- Report Number(s):
- CONF-981104-; ISBN 1-55899-458-0; ISSN 1067-9995; TRN: IM0001%%120
- Resource Relation:
- Conference: High-Temperature Ordered Intermetallic Alloys VIII, Materials Research Society Symposium Proceedings, Boston, MA (US), 11/30/1998--12/03/1998; Other Information: PBD: 1999; Related Information: In: High-temperature ordered intermetallic alloys VIII. Materials Research Society symposium proceedings: Volume 552, by George, E.P.; Mills, M.J.; Yamaguchi, Masaharu [eds.], [600] pages.
- Country of Publication:
- United States
- Language:
- English
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