Zero-dimensional to three-dimensional nanojoining: current status and potential applications

Ma, Ying; Li, Hong; Bridges, Denzel; Peng, Peng; Lawrie, Benjamin; Feng, Zhili; Hu, Anming

doi:10.1039/C6RA15897H

Title: Zero-dimensional to three-dimensional nanojoining: current status and potential applications

Journal Article · Mon Aug 01 00:00:00 EDT 2016 · RSC Advances

DOI:https://doi.org/10.1039/C6RA15897H· OSTI ID:1302935

Ma, Ying ^[1]; Li, Hong ^[2]; Bridges, Denzel ^[3]; Peng, Peng ^[4]; Lawrie, Benjamin ^[5]; Feng, Zhili ^[6]; Hu, Anming ^[7]

Beijing Univ. of Technology, Beijing (China). Inst. of Laser Engineering
Beijing Univ. of Technology, Beijing (China). College of Materials Science and Engineering
Univ. of Tennessee, Knoxville, TN (United States). Dept. of Mechanical, Aerospace and Biomedical Engineering
Beijing Univ. of Technology, Beijing (China). School of Mechanical Engineering and Automation
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Computational Science and Engineering Division
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Materials Science and Technology Division
Beijing Univ. of Technology, Beijing (China). Inst. of Laser Engineering; Univ. of Tennessee, Knoxville, TN (United States). Dept. of Mechanical, Aerospace and Biomedical Engineering

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallic materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.

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Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

Sponsoring Organization:: USDOE Laboratory Directed Research and Development (LDRD) Program

Grant/Contract Number:: AC05-00OR22725

OSTI ID:: 1302935

Journal Information:: RSC Advances, Vol. 6, Issue 79; ISSN 2046-2069

Publisher:: Royal Society of ChemistryCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 31 works

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