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Title: 3D IC for Future HEP Detectors

Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. Here we describe ongoing R&D efforts to demonstrate functionality of components of such detectors. This also includes the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled into arrays of arbitrary size with high yield.
Authors:
 [1] ;  [2] ;  [3] ;  [2] ;  [3] ;  [1] ;  [2] ;  [4] ;  [2] ;  [5] ;  [6] ;  [2] ;  [7]
  1. Cornell Univ., Ithaca, NY (United States)
  2. Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
  3. Brown Univ., Providence, RI (United States)
  4. Univ. of California, Davis, CA (United States)
  5. SLAC National Accelerator Lab., Menlo Park, CA (United States)
  6. Univ. of Hawaii, Honolulu, HI (United States)
  7. Brookhaven National Lab. (BNL), Upton, NY (United States)
Publication Date:
OSTI Identifier:
1228871
Report Number(s):
BNL--110946-2015-JA
Journal ID: ISSN 1748-0221
DOE Contract Number:
SC00112704
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Instrumentation; Journal Volume: 9
Publisher:
Institute of Physics (IOP)
Research Org:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Org:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
Country of Publication:
United States
Language:
English
Subject:
24 POWER TRANSMISSION AND DISTRIBUTION