Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation)
The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.
- Publication Date:
- OSTI Identifier:
- Report Number(s):
- DOE Contract Number:
- Resource Type:
- Resource Relation:
- Conference: Presented at the FY15 APEEM Kickoff Meeting, 18-20 November 2014, Oak Ridge National Laboratory, Oak Ridge, Tennessee; Related Information: NREL (National Renewable Energy Laboratory)
- Research Org:
- National Renewable Energy Laboratory (NREL), Golden, CO.
- Sponsoring Org:
- USDOE Office of Energy Efficiency and Renewable Energy Vehicle Technologies Office
- Country of Publication:
- United States
- 33 ADVANCED PROPULSION SYSTEMS; 30 DIRECT ENERGY CONVERSION BONDED INTERFACES; SINTERED-SILVER; RELIABILITY; DELAMINATION; STRESS INTENSITY FACTOR
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