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Title: Environmentally-assisted technique for transferring devices onto non-conventional substrates

Patent ·
OSTI ID:1151764
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A device fabrication method includes: (1) providing a growth substrate including a base and an oxide layer disposed over the base; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.

Research Organization:
Leland Stanford Junior University, Palo Alto, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
SC0001060
Assignee:
Board of Trustees of the Leland Stanford Junior University (Palo Alto, CA)
Patent Number(s):
8,815,707
Application Number:
13/791,214
OSTI ID:
1151764
Country of Publication:
United States
Language:
English

References (13)

Electronic Device and Method for Producing a Device patent-application February 2008
Multilayer Wiring Board and Method for Manufacturing the Same and Probe Apparatus patent-application December 2008
Semiconductor Package and Method for Producing Same patent-application January 2009
Method for Manufacturing Flexible Semiconductor Device patent-application May 2010
Semiconductor Power Device Having A Stacked Discrete Inductor Structure patent-application September 2011
On the physics of moisture-induced cracking in metal-glass (copper-silica) interfaces journal September 2007
Stretchable and Foldable Silicon Integrated Circuits journal April 2008
Moisture-assisted subcritical debonding of a polymer/metal interface journal February 2002
Wafer-Scale Synthesis and Transfer of Graphene Films journal February 2010
Peel-and-Stick: Fabricating Thin Film Solar Cell on Universal Substrates journal December 2012
Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/Transparent Thin-film Electronics journal October 2013
Fabrication of Nanowire Electronics on Nonconventional Substrates by Water-Assisted Transfer Printing Method journal August 2011
Ultrathin silicon solar microcells for semitransparent, mechanically flexible and microconcentrator module designs journal October 2008

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