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Title: SURFACE FILMS TO SUPPRESS FIELD EMISSION IN HIGH-POWER MICROWAVE COMPONENTS

Results are reported on attempts to reduce the RF breakdown probability on copper accelerator structures by applying thin surface films that could suppress field emission of electrons. Techniques for application and testing of copper samples with films of metals with work functions higher than copper are described, principally for application of platinum films, since platinum has the second highest work function of any metal. Techniques for application of insulating films are also described, since these can suppress field emission and damage on account of dielectric shielding of fields at the copper surface, and on account of the greater hardness of insulating films, as compared with copper. In particular, application of zirconium oxide films on high-field portions of a 11.424 GHz SLAC cavity structure for breakdown tests are described.
Authors:
Publication Date:
OSTI Identifier:
1118602
Report Number(s):
ER86223-p48 FINAL REPORT
DOE Contract Number:
FG02-04ER86223
Resource Type:
Technical Report
Research Org:
Omega-P, Inc.
Sponsoring Org:
USDOE; USDOE Office of Science (SC)
Country of Publication:
United States
Language:
English
Subject:
43 PARTICLE ACCELERATORS RF breakdown, thin films on accelerator structures, suppression of field emission