Status and Trend of Automotive Power Packaging
Conference
·
OSTI ID:1048157
- ORNL
Comprehensive requirements in aspects of cost, reliability, efficiency, form factor, weight, and volume for power electronics modules in modern electric drive vehicles have driven the development of automotive power packaging technology intensively. Innovation in materials, interconnections, and processing techniques is leading to enormous improvements in power modules. In this paper, the technical development of and trends in power module packaging are evaluated by examining technical details with examples of industrial products. The issues and development directions for future automotive power module packaging are also discussed.
- Research Organization:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
- Sponsoring Organization:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE)
- DOE Contract Number:
- DE-AC05-00OR22725
- OSTI ID:
- 1048157
- Resource Relation:
- Conference: 24th IEEE International Symposium on Power Semiconductor Devices and ICs, Bruges, Belgium, 20120603, 20120607
- Country of Publication:
- United States
- Language:
- English
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