High-Power Comparison Among Brazed, Clamped and Electroformed X-Band Cavities

Journal Article · Wed Apr 25 00:00:00 EDT 2012 · Nuclear Instruments and Methods in Physics Research, Section A

OSTI ID:1039180

Spataro, B; Alesini, D; Chimenti, V; Dolgashev, V; Higashi, Y; Migliorati, M; Mostacci, A; Parodi, R; Tantawi, S G; Yeremian, A D

We report the building procedure of X-band copper structures using the electroforming and electroplating techniques. These techniques allow the deposition of copper layers on a suitable die and they can be used to build RF structures avoiding the high temperature brazing step in the standard technique. We show the constructed prototypes and low power RF measurements and discuss the results of the high power tests at SLAC National Accelerator Laboratory.

• Research Organization: SLAC National Accelerator Lab., Menlo Park, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC02-76SF00515
• OSTI ID: 1039180
• Report Number(s): SLAC-REPRINT-2012-050; NIMAER; TRN: US1202092
• Journal Information: Nuclear Instruments and Methods in Physics Research, Section A, Vol. 657, Issue 1; ISSN 0168-9002
• Country of Publication: United States
• Language: English

Related Subjects

43 PARTICLE ACCELERATORS
ACCELERATION
AMPLIFIERS
BRAZING
CAVITIES
COPPER
DEPOSITION
ELECTRODEPOSITION
ELECTROPLATING
FERMILAB ACCELERATOR
LINEAR ACCELERATORS
RESONATORS
STANFORD LINEAR ACCELERATOR CENTER
Accelerators
ACCPHY