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  1. The role of sample–window coupling in shock temperature experiments

    Radiometric studies of opaque materials under shock compression probe a sample–window interface that may be very different than the bulk state. Subtle experimental details, particularly an initial sample–window gap vs an adhesively bonded stack, have tremendous influence on measured temperature. This work experimentally tests gapped vs bonded targets and theoretically investigates observed differences in the measured temperature. The results indicate that perturbations created by a thin adhesive are smaller than those suggested by a previous work, whereas sample–window gaps alter the measured state more significantly than that previously realized.
  2. On plasticity-enhanced interfacial toughness in bonded joints

    Here, the performance and reliability of many structures and components depend on the integrity of interfaces between dissimilar materials. Interfacial toughness Γ is the key material parameter that characterizes resistance to interfacial crack growth, and Γ is known to depend on many factors including temperature. For example, previous work showed that the toughness of an epoxy/aluminum interface decreased 40 % as the test temperature was increased from -60 °C to room temperature (RT). Interfacial integrity at elevated temperatures is of considerable practical importance. Recent measurements show that instead of continuing to decrease with increasing temperature, Γ increases when test temperaturemore » is above RT. Cohesive zone finite element calculations of an adhesively bonded, asymmetric double cantilever beam specimen of the type used to measure Γ suggest that this increase in toughness may be a result of R-curve behavior generated by plasticity-enhanced toughening during stable subcritical crack growth with interfacial toughness defined as the critical steady-state limit value. In these calculations, which used an elastic-perfectly plastic epoxy model with a temperature-dependent yield strength, the plasticity-enhanced increase in Γ above its intrinsic value Γo depended on the ratio of interfacial strength σ* to the yield strength σyb of the bond material. There is a nonlinear relationship between Γ/Γo and σ*/σyb with the value Γ/Γo increasing rapidly above a threshold value of σ*/σyb. The predicted increase in toughness can be significant. For example, there is nearly a factor of two predicted increase in Γ/Γo during micrometer-scale crack-growth when σ*/σyb = 2 (a reasonable choice for σ*/σyb). Furthermore, contrary to other reported results, plasticity-enhanced toughening can occur prior to crack advance as the cohesive zone forms and the peak stress at the tip of the original crack tip translates to the tip of the fully formed cohesive zone. These results suggest that plasticity-enhanced toughening should be considered when modeling interfaces at elevated temperatures.« less
  3. Enabling resonant ultrasound spectroscopy in high magnetic fields

    Resonant ultrasound spectroscopy (RUS) is a powerful method to determine elastic constants with high accuracy and precision from a single measurement of the mechanical resonances of a sample. Conventionally, the quantitative extraction of elastic moduli with RUS assumes free boundary conditions which can often lead to the adoption of unstable sample positioning between ultrasonic transducers that is incompatible with extreme environments like high magnetic fields. We show that, under specific conditions, introducing a small amount of adhesive between a RUS sample and ultrasonic transducers introduces a perturbation to the free resonance condition which can be accounted for by a simplemore » model. This means elastic constants can be determined to within the uncertainty of conventional RUS, but with significant improvements including sample stability and control of sample orientation. We demonstrate the efficacy of this approach with measurements on a range of materials including room temperature measurements on polycrystalline metals, temperature-dependent measurements of the structural phase transition in strontium titanate single crystals, and magnetic field-dependent measurements of magnetic phase transitions in gadolinium polycrystals up to 14 T.« less
  4. A renewable lignin-based thermoplastic adhesive for steel joining

    Adhesive bonding of metals has become increasingly relevant in recent years due to the demand for reducing weight and improving performance in structural applications such as automobiles and aerospace. We developed renewable thermoplastic adhesives from technical organosolv lignin isolated from hardwood biomass and acrylonitrile butadiene co-polymer rubber (NBR) for joining steel substrates. NBR33, NBR41 and NBR51 with acrylonitrile molar ratios of 33, 41 and 51%, respectively, were blended with lignin to form two-phase thermoplastic adhesives, and their adhesion, viscoelastic and surface properties were measured. Lignin content in the compositions were varied, ranging from 40% to 80% (w/w), to alter toughness,more » stiffness, and surface energy characteristics of the material. Better interaction or reactivity between the lignin and NBR phases was observed with greater nitrile content in NBR, leading to greater modulus and stiffness of the adhesive. Simultaneously, increasing the proportion of lignin reduced toughness and improved stiffness, with the highest adhesive strength of 13.1 MPa measured in a 60% lignin loading ratio with NBR51. Surface energy measurements revealed that total surface energy (sum of polar and dispersive surface energy) raised with lignin loading, suggesting that both surface energy and matrix strength play a critical role in the adhesive properties of the synthesized materials. A finite element-based cohesive zone model (CZM) was developed and implemented to study the failure strength of the adhesively bonded joint. Here, this study demonstrates the viability of lignin as a valuable building block for adhesives, not only due to its inherent chemical structure and rigidity, but also for its surface energy characteristics.« less
  5. Initiated chemical vapor deposition polymers for high peak-power laser targets

    Here, we report two examples of initiated chemical vapor deposition (iCVD) polymers being developed for use in laser targets for high peak-power laser systems. First, we show that iCVD poly(divinylbenzene) is more photo-oxidatively stable than the plasma polymers currently used in laser targets. Thick layers (10–12 μm) of this highly crosslinked polymer can be deposited with near-zero intrinsic film stress. Second, we show that iCVD epoxy polymers can be crosslinked after deposition to form thin adhesive layers for assembling precision laser targets. The bondlines can be made as thin as ~ 1 μm, approximately a factor of 2 thinner thanmore » achievable using viscous resin-based adhesives. These bonds can withstand downstream coining and stamping processes.« less
  6. Field testing of thermoplastic encapsulants in high‐temperature installations

    Abstract Recently there has been increased interest in using thermoplastic encapsulant materials in photovoltaic modules, but concerns have been raised about whether these would be mechanically stable at high temperatures in the field. Recently, this has become a significant topic of discussion in the development of IEC 61730 and IEC 61215. We constructed eight pairs of crystalline‐silicon modules and eight pairs of glass/encapsulation/glass thin‐film mock modules using different encapsulant materials, of which only two were formulated to chemically crosslink. One module set was exposed outdoors with thermal insulation on the back side in Mesa, Arizona, in the summer (hot‐dry), andmore » an identical module set was exposed in environmental chambers. High‐precision creep measurements (±20  μ m) and electrical performance measurements indicate that despite many of these polymeric materials operating in the melt or rubbery state during outdoor deployment, no significant creep was seen because of their high viscosity, lower operating temperature at the edges, and/or the formation of chemical crosslinks in many of the encapsulants with age despite the absence of a crosslinking agent. Only an ethylene‐vinyl acetate ( EVA ) encapsulant formulated without a peroxide crosslinking agent crept significantly. In the case of the crystalline‐silicon modules, the physical restraint of the backsheet reduced creep further and was not detectable even for the EVA without peroxide. Because of the propensity of some polymeric materials to crosslink as they age, typical thermoplastic encapsulants would be unlikely to result in creep in the vast majority of installations.« less

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