Chemical Amplification of Subthreshold Base Triggers To Drive Sol–Gel Transitions in Polymers

Lai, Shuqi; Chaudhary, Gaurav; Jiang, Zhelong; Ewoldt, Randy H.; Braun, Paul V.

doi:10.1021/acsmaterialslett.2c00480

Title: Chemical Amplification of Subthreshold Base Triggers To Drive Sol–Gel Transitions in Polymers

Journal Article · Mon Jul 18 00:00:00 UTC 2022 · ACS Materials Letters

DOI: https://doi.org/10.1021/acsmaterialslett.2c00480 · OSTI ID:3013065

Lai, Shuqi ^[1]; Chaudhary, Gaurav ^[2];

^[3];

^[4];

^[4]

University of Illinois at Urbana−Champaign, IL (United States); Intel Corporation, Chandler, AZ (United States)
University of Illinois at Urbana−Champaign, IL (United States); Intel Corporation, Hudson, MA (United States)
University of Illinois at Urbana−Champaign, IL (United States); SLAC National Accelerator Laboratory (SLAC), Menlo Park, CA (United States)
University of Illinois at Urbana−Champaign, IL (United States)

Chemical amplification has been widely applied in applications ranging from stimuli sensing to advanced photoresists, but it is rarely utilized to drive productive mechanical property changes. Here, we demonstrate the use of a base amplifier to drive the gelation of a functional polymer solution, in response to a subthreshold base trigger through a mechanism whereby the trigger drives a dramatic increase in the base concentration driven by base amplification, resulting in complexation of Fe(III) and polymer-bound catechol groups and subsequent gelation of the polymer solution. Furthermore, the concomitant crystallization of dibenzofulvene, which is a byproduct of base amplification, led to significant stiffening of the resultant gel and an unexpected temperature-sensitive change of gel stiffness.

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Research Organization:: Univ. of Illinois at Urbana-Champaign, IL (United States); University of Illinois at Urbana−Champaign, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division (MSE)

Grant/Contract Number:: SC0020858

OSTI ID:: 3013065

Journal Information:: ACS Materials Letters, Journal Name: ACS Materials Letters Journal Issue: 8 Vol. 4; ISSN 2639-4979

Publisher:: American Chemical Society (ACS)Copyright Statement

Country of Publication:: United States

Language:: English

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