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Title: Oblique microchannel merged with circle micro pin-fin as a novel hybrid heat sink for cooling of electronic devices

Journal Article · · Case Studies in Thermal Engineering

Not Available

Sponsoring Organization:
USDOE
Grant/Contract Number:
SC0020113
OSTI ID:
2229456
Journal Information:
Case Studies in Thermal Engineering, Journal Name: Case Studies in Thermal Engineering Journal Issue: C Vol. 53; ISSN 2214-157X
Publisher:
ElsevierCopyright Statement
Country of Publication:
Netherlands
Language:
English

References (27)

Pressure drop and thermal performance of CuO/ethylene glycol (60%)-water (40%) nanofluid in car radiator journal December 2014
Performance evaluation criteria for use of enhanced heat transfer surfaces in heat exchanger design journal April 1981
A Review on efficient thermal management of air- and liquid-cooled data centers: From chip to the cooling system journal November 2017
Performance evaluation of high concentration photovoltaic cells cooled by microchannels heat sink with serpentine reentrant microchannels journal March 2022
Investigation of flow and heat transfer characteristics in micro pin fin heat sink with nanofluid journal February 2014
A review on heat transfer and hydrodynamic characteristics of nano/microencapsulated phase change slurry (N/MPCS) in mini/microchannel heat sinks journal May 2018
Pin-fin shape-dependent heat transfer and fluid flow characteristics of water- and nanofluid-cooled micropin-fin heat sinks: Square, circular and triangular fin cross-sections journal July 2019
Thermo-hydraulic performance of wavy microchannel heat sink with oblique grooved finned journal May 2021
Investigating the effect of Brownian motion and viscous dissipation on the nanofluid heat transfer in a trapezoidal microchannel heat sink journal January 2015
A comparison of the heat transfer performance and pressure drop of nanofluid-cooled heat sinks with different miniature pin fin configurations journal December 2015
Water cooled corrugated minichannel heat sink for electronic devices: Effect of corrugation shape journal August 2016
Numerical investigation and optimization of a heat sink having hemispherical pin fins journal March 2021
Shape optimisation of wavy mini-channel heat sink journal March 2021
Numerical investigation of heat transfer performance for rectangular, elliptical, and airfoil shaped pin fin heatsinks through the novel combination of perforation and bulge inserts journal November 2022
Fluid flow and heat transfer in wavy microchannels journal June 2010
Numerical study of thermal enhancement in micro channel heat sink with secondary flow journal November 2014
Fluid flow and heat transfer investigations on enhanced microchannel heat sink using oblique fins with parametric study journal February 2015
Effect of fin shape on the thermal performance of nanofluid-cooled micro pin-fin heat sinks journal November 2018
An experimental study of flow friction and heat transfer in wavy microchannels with rectangular cross section journal December 2011
Effects of nooks configuration on hydrothermal performance of zigzag channels for nanofluid-cooled microelectronic heat sink journal December 2017
Experimental and numerical investigations of turbulent forced convection flow of nano-fluid in helical coiled tubes at constant surface temperature journal October 2015
Investigation of wavy microchannel ability on electronic devices cooling with the case study of choosing the most efficient microchannel pattern journal April 2022
A numerical study on thermo-hydraulic performance of micro pin-fin heat sink using hybrid pin-fins arrangement for electronic cooling devices journal March 2023
High-performance heat sinking for VLSI journal May 1981
History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat Transfer in Microchannels: A Critical Review journal January 2012
Enhanced Thermal Transport in Microchannel Using Oblique Fins journal August 2012
A review of passive methods in microchannel heat sink application through advanced geometric structure and nanofluids: Current advancements and challenges journal December 2020

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