Oblique microchannel merged with circle micro pin-fin as a novel hybrid heat sink for cooling of electronic devices
Journal Article
·
· Case Studies in Thermal Engineering
Not Available
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- SC0020113
- OSTI ID:
- 2229456
- Journal Information:
- Case Studies in Thermal Engineering, Journal Name: Case Studies in Thermal Engineering Journal Issue: C Vol. 53; ISSN 2214-157X
- Publisher:
- ElsevierCopyright Statement
- Country of Publication:
- Netherlands
- Language:
- English
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