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Title: Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Journal Article · · Journal of Electronic Packaging
DOI: https://doi.org/10.1115/1.4056306 · OSTI ID:1902146

We report progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field where semiconductor physics and electrical, thermal, and mechanical design knowledge converge to achieve a practical realization of desired targets in the form of conversion efficiency, power density, and reliability. Due to the promising nature of artificial intelligence in delivering rapid results, engineers are starting to explore the ways in which it can contribute to making power electronics more compact and reliable. Here, we conduct a brief review of the foray of artificial intelligence in three distinct subtechnologies within a power electronics system in the context of electric vehicles: semiconductor devices, power electronics module design and prognostics, and thermal management design. The intent is not to report an exhaustive literature review, but to identify the state of the art and opportunities for artificial intelligence to play a meaningful role in power electronics design from a mechanical and thermal standpoint, as well as to discuss a few promising future research directions.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
Grant/Contract Number:
AC36-08GO28308
OSTI ID:
1902146
Report Number(s):
NREL/JA-5400-81720; MainId:82493; UUID:25488035-30af-4ee0-a712-32c0c046bd4e; MainAdminID:68167
Journal Information:
Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging Journal Issue: 3 Vol. 145; ISSN 1043-7398
Publisher:
ASMECopyright Statement
Country of Publication:
United States
Language:
English

References (39)

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A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues journal March 2020
Accelerating Chip Design With Machine Learning journal November 2020
Artificial Intelligence Techniques: How Can it Solve Problems in Power Electronics?: An Advancing Frontier journal December 2020
Heat Sink Design for WBG Power Modules Based on Fourier Series and Evolutionary Multi-Objective Multi-Physics Optimization journal January 2021
Lifetime Estimation of Discrete IGBT Devices Based on Gaussian Process journal January 2018
Prognostic and Warning System for Power-Electronic Modules in Electric, Hybrid Electric, and Fuel-Cell Vehicles journal June 2008
Operating Electric Vehicle Fleet for Ride-Hailing Services With Reinforcement Learning journal November 2020
Condition Monitoring for Device Reliability in Power Electronic Converters: A Review journal November 2010
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Review of Power Semiconductor Device Reliability for Power Converters journal June 2017
Application of Artificial Neural Networks in Crystal Growth of Electronic and Opto-Electronic Materials journal August 2020

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