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The Ga-In (Gallium-Indium) System
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journal
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February 1991 |
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Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection
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journal
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November 2013 |
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The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging
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journal
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June 2006 |
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Tensile strength and ductility of indium
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journal
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July 1988 |
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Effect of temperature on the sputtering yield of copper
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journal
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May 1976 |
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Temperature dependence of sputtering behavior of Cu-Li alloys
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journal
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May 1987 |
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Sputtering yield increase with target temperature for Ag
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journal
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July 1993 |
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Study of temperature rise during focused Ga ion beam irradiation using nanothermo-probe
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journal
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October 2009 |
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Focused ion beam milling and scanning electron microscopy characterization of polymer+metal hybrids
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journal
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March 2007 |
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Reliability challenges in 3D IC packaging technology
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journal
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March 2011 |
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Low temperature FIB cross section: Application to indium micro bumps
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journal
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September 2014 |
Development of an Indium bump bond process for silicon pixel detectors at PSI
- Broennimann, Ch.; Glaus, F.; Gobrecht, J.
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Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 565, Issue 1
https://doi.org/10.1016/j.nima.2006.05.011
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journal
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September 2006 |
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Progress in focal plane array technologies
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journal
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March 2012 |
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Sputtering of ice by low-energy ions
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journal
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January 2008 |
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Ion beam heating of kinetically constrained nanomaterials
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journal
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March 2018 |
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FIB / FESEM Investigations of Polymer / Inorganic Composites
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journal
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July 2006 |
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Cryo-FIB Minimizes Ga+ Milling Artifacts in Sn
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journal
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August 2014 |
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3D integrated superconducting qubits
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journal
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October 2017 |
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High coherence superconducting microwave cavities with indium bump bonding
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journal
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April 2020 |
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An investigation of thermal spikes by studying the high energy sputtering of metals at elevated temperatures
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journal
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February 1965 |
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Development of indium bumping technology through AZ9260 resist electroplating
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journal
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April 2010 |
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Qubit compatible superconducting interconnects
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journal
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November 2017 |
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Evaluation of Sn-based microbumping technology for hybrid IR detectors, 10µm pitch to 5µm pitch
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conference
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May 2015 |
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Cryogenic Qubit Integration for Quantum Computing
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conference
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May 2018 |
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Intermetallics formation and evolution in pure indium joint for cryogenic application
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conference
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December 2009 |
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High density indium bumping using electrodeposition enhanced by megasonic agitation
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conference
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December 2009 |
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Interfacial Reactions of Cu and In for Low-Temperature Processes
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conference
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December 2019 |
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High density indium bumping through pulse plating used for pixel X-Ray detectors
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conference
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August 2009 |
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A technique for improved focused ion beam milling of cryo-prepared life science specimens
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journal
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June 2007 |
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Minimizing damage during FIB sample preparation of soft materials: FIB SAMPLE PREPARATION OF SOFT MATERIALS
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journal
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November 2011 |
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Structure and Recrystallization of Indium Thin Film
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journal
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July 1969 |
Sputtering rate of micromilling on water ice with focused ion beam in a cryogenic environment
- Fu, Jing; Joshi, Sanjay B.; Catchmark, Jeffrey M.
-
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 26, Issue 3
https://doi.org/10.1116/1.2902962
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journal
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May 2008 |
Low homologous temperature (<0.2) sputtering of indium films on silicon
- Dang, Tuoc; Shima, Darryl; Balakrishnan, Ganesh
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Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 30, Issue 6
https://doi.org/10.1116/1.4753818
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journal
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November 2012 |
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Short Communications and Laboratory / Tips Labortips und Rezepte
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journal
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January 1970 |
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Focused Ion Beam Microscopy and Micromachining
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journal
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May 2007 |
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TEM Sample Preparation and FIB-Induced Damage
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journal
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May 2007 |
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An Evaluation of FIB Cross-Sectioning Using a Cooling Stage for Metals and Alloys with Low Melting Point
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journal
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March 2013 |