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Title: Mapping of the mechanical response in Si/SiGe nanosheet device geometries

Journal Article · · Communications Engineering

Abstract The performance of next-generation, nanoelectronic devices relies on a precise understanding of strain within the constituent materials. However, the increased flexibility inherent to these three-dimensional device geometries necessitates direct measurement of their deformation. Here we report synchrotron x-ray diffraction-based non-destructive nanoscale mapping of Si/SiGe nanosheets for gate-all-around structures. We identified two competing mechanisms at different length scales contributing to the deformation. One is consistent with the in-plane elastic relaxation due to the Ge lattice mismatch with the surrounding Si. The second is associated with the out-of-plane layering of the Si and SiGe regions at a length scale of film thickness. Complementary mechanical modeling corroborated the qualitative aspects of the deformation profiles observed across a variety of nanosheet sample widths. However, greater deformation is observed in the SiGe layers of the nanosheets than the predicted distributions. These insights could play a role in predicting carrier mobilities of future devices.

Sponsoring Organization:
USDOE
Grant/Contract Number:
SC0012704
OSTI ID:
1871858
Journal Information:
Communications Engineering, Journal Name: Communications Engineering Journal Issue: 1 Vol. 1; ISSN 2731-3395
Publisher:
Nature Publishing GroupCopyright Statement
Country of Publication:
Country unknown/Code not available
Language:
English

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