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Title: Unveiling 3D Morphology of Multiscale Micro-Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X-ray Nanotomography

Abstract

The sintering processing–structure–property relationship of a multiscale silver materials is investigated: microparticles with nanofeatures, particularly on their three-dimensional (3D) morphology. The target application is to replace conventional lead-based solders in advanced electronic manufacturing. Unlike lead-based solders, silver powders are suited to satisfy increasingly demanding mechanical, electrical, and thermal requirements, meanwhile being free of health effect. Sintering the material at a low temperature and without applied pressure are desirable conditions, which results in a preferred use of silver nanoparticles, as nanofeatures have higher driving force to sinter with the decrease in particle size. However, nanosized powders present potential health/environmental effects. To address the trade-off between the benefits and shortcomings of nano-versus microparticles, this work studies a novel multiscale silver paste, namely micron-sized powders with nanosized features. To get quantitative 3D visualization of micro- and nanoscale features, ptychographic X-ray computed nanotomography is applied. The correlations between conditions (thermal aging, pressure, and substrate metallization), mechanical properties, and morphological parameters are established. Finally, using novel 3D X-ray nanoimaging technique, it is demonstrated that one can design multiscale materials while balancing complex demands required in advanced electronics manufacturing and research directions in materials design and characterization.

Authors:
 [1]; ORCiD logo [1];  [2]; ORCiD logo [3];  [1];  [4];  [4];  [2];  [5]
+ Show Author Affiliations
  1. Stony Brook Univ., NY (United States)
  2. Henkel Corporation, Bridgewater, NJ (United States)
  3. Paul Scherrer Inst. (PSI), Villigen (Switzerland). Swiss Light Source; Brookhaven National Lab. (BNL), Upton, NY (United States). Center for Functional Nanomaterials (CFN)
  4. Paul Scherrer Inst. (PSI), Villigen (Switzerland). Swiss Light Source
  5. Stony Brook Univ., NY (United States); Brookhaven National Lab. (BNL), Upton, NY (United States). National Synchrotron Light Source II (NSLS-II)
Publication Date:
Research Org.:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES); Swiss National Science Foundation (SNSF)
OSTI Identifier:
1607713
Alternate Identifier(s):
OSTI ID: 1600580
Report Number(s):
BNL-213754-2020-JAAM
Journal ID: ISSN 1438-1656
Grant/Contract Number:  
SC0012704; 200021_152554; 200020_169623
Resource Type:
Accepted Manuscript
Journal Name:
Advanced Engineering Materials
Additional Journal Information:
Journal Volume: 22; Journal Issue: 4; Journal ID: ISSN 1438-1656
Publisher:
Wiley
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; Ptychography; Silver paste; Tomography; Nano-CT; Porous

Citation Formats

Lin, Yu-Chung, Liu, Xiaoyang, Chou, Kang Wei, Tsai, Esther H. R., Zhao, Chonghang, Holler, Mirko, Diaz, Ana, Petrash, Stanislas, and Chen-Wiegart, Yu-chen Karen. Unveiling 3D Morphology of Multiscale Micro-Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X-ray Nanotomography. United States: N. p., 2020. Web. doi:10.1002/adem.201901250.
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Lin, Yu-Chung, Liu, Xiaoyang, Chou, Kang Wei, Tsai, Esther H. R., Zhao, Chonghang, Holler, Mirko, Diaz, Ana, Petrash, Stanislas, & Chen-Wiegart, Yu-chen Karen. Unveiling 3D Morphology of Multiscale Micro-Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X-ray Nanotomography. United States. https://doi.org/10.1002/adem.201901250
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Lin, Yu-Chung, Liu, Xiaoyang, Chou, Kang Wei, Tsai, Esther H. R., Zhao, Chonghang, Holler, Mirko, Diaz, Ana, Petrash, Stanislas, and Chen-Wiegart, Yu-chen Karen. Thu . "Unveiling 3D Morphology of Multiscale Micro-Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X-ray Nanotomography". United States. https://doi.org/10.1002/adem.201901250. https://www.osti.gov/servlets/purl/1607713.
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@article{osti_1607713,
title = {Unveiling 3D Morphology of Multiscale Micro-Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X-ray Nanotomography},
author = {Lin, Yu-Chung and Liu, Xiaoyang and Chou, Kang Wei and Tsai, Esther H. R. and Zhao, Chonghang and Holler, Mirko and Diaz, Ana and Petrash, Stanislas and Chen-Wiegart, Yu-chen Karen},
abstractNote = {The sintering processing–structure–property relationship of a multiscale silver materials is investigated: microparticles with nanofeatures, particularly on their three-dimensional (3D) morphology. The target application is to replace conventional lead-based solders in advanced electronic manufacturing. Unlike lead-based solders, silver powders are suited to satisfy increasingly demanding mechanical, electrical, and thermal requirements, meanwhile being free of health effect. Sintering the material at a low temperature and without applied pressure are desirable conditions, which results in a preferred use of silver nanoparticles, as nanofeatures have higher driving force to sinter with the decrease in particle size. However, nanosized powders present potential health/environmental effects. To address the trade-off between the benefits and shortcomings of nano-versus microparticles, this work studies a novel multiscale silver paste, namely micron-sized powders with nanosized features. To get quantitative 3D visualization of micro- and nanoscale features, ptychographic X-ray computed nanotomography is applied. The correlations between conditions (thermal aging, pressure, and substrate metallization), mechanical properties, and morphological parameters are established. Finally, using novel 3D X-ray nanoimaging technique, it is demonstrated that one can design multiscale materials while balancing complex demands required in advanced electronics manufacturing and research directions in materials design and characterization.},
doi = {10.1002/adem.201901250},
journal = {Advanced Engineering Materials},
number = 4,
volume = 22,
place = {United States},
year = {Thu Feb 06 00:00:00 EST 2020},
month = {Thu Feb 06 00:00:00 EST 2020}
}
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Journal Article:
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Publisher's Version of Record
https://doi.org/10.1002/adem.201901250
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