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Title: Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography

Authors:
 [1]; ORCiD logo [1];  [2];  [3];  [1];  [4];  [4];  [5];  [6]
  1. Department of Materials Science and Chemical EngineeringStony Brook University Stony Brook NY 11794 USA
  2. Henkel Adhesive TechnologiesGlobal Innovation ResearchAdvanced Characterization Group Hendel Ibérica S.A. Campus UAB Edificio Eureka 08193 Bellaterra
  3. Swiss Light SourcePaul Scherrer Institute Forschungsstrasse 111 CH-5232 Villigen Switzerland, Center for Functional NanomaterialsBrookhaven National Laboratory Upton NY 11973 USA
  4. Swiss Light SourcePaul Scherrer Institute Forschungsstrasse 111 CH-5232 Villigen Switzerland
  5. Henkel Adhesive TechnologiesGlobal Innovation ResearchAdvanced Characterization Group Henkel Corporation Bridgewater NJ 08807 USA
  6. Department of Materials Science and Chemical EngineeringStony Brook University Stony Brook NY 11794 USA, National Synchrotron Light Source IIBrookhaven National Laboratory Upton NY 11973 USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1600580
Grant/Contract Number:  
[SC0012704]
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Advanced Engineering Materials
Additional Journal Information:
[Journal Name: Advanced Engineering Materials]; Journal ID: ISSN 1438-1656
Publisher:
Wiley Blackwell (John Wiley & Sons)
Country of Publication:
Germany
Language:
English

Citation Formats

Lin, Yu-Chung, Liu, Xiaoyang, Chou, Kang Wei, Tsai, Esther H. R., Zhao, Chonghang, Holler, Mirko, Diaz, Ana, Petrash, Stanislas, and Chen-Wiegart, Yu-chen Karen. Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography. Germany: N. p., 2020. Web. doi:10.1002/adem.201901250.
Lin, Yu-Chung, Liu, Xiaoyang, Chou, Kang Wei, Tsai, Esther H. R., Zhao, Chonghang, Holler, Mirko, Diaz, Ana, Petrash, Stanislas, & Chen-Wiegart, Yu-chen Karen. Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography. Germany. doi:10.1002/adem.201901250.
Lin, Yu-Chung, Liu, Xiaoyang, Chou, Kang Wei, Tsai, Esther H. R., Zhao, Chonghang, Holler, Mirko, Diaz, Ana, Petrash, Stanislas, and Chen-Wiegart, Yu-chen Karen. Wed . "Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography". Germany. doi:10.1002/adem.201901250.
@article{osti_1600580,
title = {Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography},
author = {Lin, Yu-Chung and Liu, Xiaoyang and Chou, Kang Wei and Tsai, Esther H. R. and Zhao, Chonghang and Holler, Mirko and Diaz, Ana and Petrash, Stanislas and Chen-Wiegart, Yu-chen Karen},
abstractNote = {},
doi = {10.1002/adem.201901250},
journal = {Advanced Engineering Materials},
number = ,
volume = ,
place = {Germany},
year = {2020},
month = {2}
}

Journal Article:
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