Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

Mariscal, Juan Cristobal; McAllister, Jeffrey; Sampurno, Yasa; Suarez, Jon Sierra; Borucki, Leonard; Philipossian, Ara

doi:10.1149/2.0141905jss

Title: Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

Authors:

;

; Suarez, Jon Sierra;

; Philipossian, Ara

Publication Date:: Tue Apr 02 00:00:00 EDT 2019

Sponsoring Org.:: USDOE

OSTI Identifier:: 1504522

Resource Type:: Published Article

Journal Name:: ECS Journal of Solid State Science and Technology

Additional Journal Information:: Journal Name: ECS Journal of Solid State Science and Technology Journal Volume: 8 Journal Issue: 5; Journal ID: ISSN 2162-8769

Publisher:: The Electrochemical Society

Country of Publication:: United States

Language:: English

Citation Formats


                    Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, and Philipossian, Ara. Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In.  United States: N. p., 2019. 
Web.  doi:10.1149/2.0141905jss.

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                    Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, & Philipossian, Ara. Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In.  United States.  https://doi.org/10.1149/2.0141905jss

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                    Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, and Philipossian, Ara. Tue .  
"Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In".  United States.  https://doi.org/10.1149/2.0141905jss.

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@article{osti_1504522,

  title        = {Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In},

  author       = {Mariscal, Juan Cristobal and McAllister, Jeffrey and Sampurno, Yasa and Suarez, Jon Sierra and Borucki, Leonard and Philipossian, Ara},

  abstractNote = {},

  doi          = {10.1149/2.0141905jss},

  journal      = {ECS Journal of Solid State Science and Technology},

  number       = 5,

  volume       = 8,

  place        = {United States},

  year         = {Tue Apr 02 00:00:00 EDT 2019},

  month        = {Tue Apr 02 00:00:00 EDT 2019}

}

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Cited by: 6 works

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Works referenced in this record:

Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces
journal, April 2010

Sun, Ting; Zhuang, Yun; Borucki, Leonard
Japanese Journal of Applied Physics, Vol. 49, Issue 4
DOI: 10.1143/JJAP.49.046501

Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging
journal, February 2010

Sun, Ting; Borucki, Len; Zhuang, Yun
Japanese Journal of Applied Physics, Vol. 49, Issue 2
DOI: 10.1143/JJAP.49.026501

CMP Pad Break-in Time Reduction in Silicon Wafer Polishing
journal, January 2007

Jeong, H. D.; Park, K. H.; Cho, K. K.
CIRP Annals, Vol. 56, Issue 1
DOI: 10.1016/j.cirp.2007.05.082

Effects of pad properties on material removal in chemical mechanical polishing
journal, June 2007

Park, K. H.; Kim, H. J.; Chang, O. M.
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Chemical mechanical planarization for microelectronics applications
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Zantye, Parshuram B.; Kumar, Ashok; Sikder, A. K.
Materials Science and Engineering: R: Reports, Vol. 45, Issue 3-6
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Erratum: Synthesis of Pt/TiO2 Nanotube Catalysts for Cathodic Oxygen Reduction [J. Electrochem. Soc., 155, B915 (2008)]
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Lee, Woo-Jin; Alhoshan, Mansour; Yohe, Sara L.
Journal of The Electrochemical Society, Vol. 157, Issue 6
DOI: 10.1149/1.3377120

Effect of Conditioning Downforce and Pad Break-In Time on Pad Surface Micro-Texture
journal, January 2018

McAllister, Jeffrey; Stuffle, Calliandra; Sampurno, Yasa
ECS Journal of Solid State Science and Technology, Vol. 7, Issue 5
DOI: 10.1149/2.0271805jss

CMP Active Diamond Characterization and Conditioner Wear
journal, January 2007

Borucki, Leonard; Zhuang, Rumin; Zhuang, Yun
MRS Proceedings, Vol. 991
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The Impact of Diamond Conditioning on Surface Contact in CMP Pads
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Elmufdi, Carolina L.; Muldowney, Gregory P.
MRS Proceedings, Vol. 991
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Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography
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Sun, T.; Borucki, L.; Zhuang, Y.
Microelectronic Engineering, Vol. 87, Issue 4
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Effect of Conditioner Type and Downforce, and Pad Break-In Time, on Pad Surface Micro-Texture in Chemical Mechanical Planarization
journal, January 2018

McAllister, Jeffrey; Stuffle, Calliandra; Sampurno, Yasa
ECS Journal of Solid State Science and Technology, Vol. 7, Issue 11
DOI: 10.1149/2.0261811jss

Effect of pad surface micro-texture on dishing and erosion during shallow trench isolation chemical mechanical planarization
journal, July 2014

Liao, Xiaoyan; Zhuang, Yun; Borucki, Leonard J.
Japanese Journal of Applied Physics, Vol. 53, Issue 8
DOI: 10.7567/JJAP.53.086501

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP
journal, November 2013

Vasilev, Boris; Bott, Sascha; Rzehak, Roland
Microelectronic Engineering, Vol. 111
DOI: 10.1016/j.mee.2013.04.027

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Title: Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

Citation Formats

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CMP Active Diamond Characterization and Conditioner Wear journal, January 2007

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Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging
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