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This content will become publicly available on December 21, 2018

Title: Solid state dewetting of thin plasmonic films under focused cw-laser irradiation

Elevated temperatures and large thermal gradients are a significant source of component failure in microelectronics, and is the limiting factor in heat-assisted magnetic recording (HAMR). Here, we have investigated the effect of solid-state dewetting in Au thin films, as a function of local temperature, film thickness, and substrate adhesion. In this work, a localised temperature rise is induced in thin (≤ 50 nm) polycrystalline Au films on SiO 2 substrates via focused continuous-wave laser irradiation at 488 nm. The magnitude and distribution of the total temperature rise is measured using CCD-based thermoreflectance. This also allows a sensitive measurement of the temperature at which dewetting occurs, showing that for thin (≤ 50 nm) Au films without adhesion layers, rapid dewetting can occur at temperatures as low as 50° C. The time decay of the reflected light from the illuminating laser is used to monitor locally the dynamics of solid state dewetting. TEM diffraction analysis shows significant changes in the microstructure and crystallographic texture of the films as far as 10 µm away from the illuminated area. The use of a thin metallic adhesion layer (such as Ti or Cr) is shown to significantly improve the adhesion of the Au to themore » substrate and reduce the tendency towards dewetting, but does not entirely protect it from changes to the crystallographic texture.« less
 [1] ;  [1] ;  [1] ;  [2] ;  [3] ;  [1] ;  [1]
  1. Trinity College Dublin, Dublin (Ireland). School of Physics, CRANN and AMBER
  2. Argonne National Lab. (ANL), Argonne, IL (United States). Materials Science Division; Northwestern Univ., Evanston, IL (United States). Dept. of Materials Science and Engineering
  3. Argonne National Lab. (ANL), Argonne, IL (United States). Materials Science Division
Publication Date:
Grant/Contract Number:
AC02-06CH11357; SFI/12/RC/2278
Accepted Manuscript
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 145; Journal Issue: C; Journal ID: ISSN 1359-6454
Research Org:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22). Materials Sciences & Engineering Division; Science Foundation Ireland (SFI); Western Digital Technologies, Inc.
Country of Publication:
United States
36 MATERIALS SCIENCE; Solid-state dewetting; crystallographic texture evolution; gold thin-films; substrate adhesion; temperature
OSTI Identifier: