DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Relationship between surface μ‐roughness and interface slurry particle spatial distribution during glass polishing

Abstract

Abstract During optical glass polishing, a number of interactions between the workpiece (i.e., glass), polishing slurry, and pad can influence the resulting workpiece roughness at different spatial scale lengths. In our previous studies, the particle size distribution of the slurry, the pad topography, and the amount of material removed by a single particle on the workpiece were shown to strongly correlate with roughness at AFM scale lengths (nm‐μm) and weakly at μ‐roughness scale lengths (μm‐mm). In this study, the polishing slurry pH and the generation of glass removal products are shown to influence the slurry particle spatial and height distribution at the polishing interface and the resulting μ‐roughness of the glass workpiece. A series of fused silica and phosphate glass samples were polished with various ceria and colloidal silica slurries over a range of slurry pH , and the resulting AFM roughness and μ‐roughness were measured. The AFM roughness was largely invariant with pH , suggesting that the removal function of a single particle is unchanged with pH . However, the μ‐roughness changed significantly, increasing linearly with pH for phosphate glass and having a maximum at an intermediate pH for fused silica. In addition, the spatial and height distribution ofmore » slurry particles on the pad (as measured by laser confocal microscopy) was determined to be distinctly different at low and high pH during phosphate glass polishing. Also, the zeta potential as a function of pH was measured for the workpiece, slurry, and pad with and without surrogate glass products (K 3 PO 4 for phosphate glass and Si( OH ) 4 for silica) to assess the role of interfacial charge during polishing. The addition of K 3 PO 4 significantly raised the zeta potential, whereas addition of Si( OH ) 4 had little effect on the zeta potential. An electrostatic DLVO three‐body force model, using the measured zeta potentials, was used to calculate the particle–particle, particle–workpiece, and particle–pad attractive and repulsive forces as a function of pH and the incorporation of glass products at the interface. The model predicted an increase in particle–pad attraction with an increase in pH and phosphate glass products consistent with the measured slurry distribution on the pads during phosphate glass polishing. Finally, a slurry “island” distribution gap ( IDG ) model has been formulated which utilizes the measured interface slurry distributions and a load balance to determine the interface gap, the contact area fraction, and the load on each slurry “island”. The IDG model was then used to simulate the workpiece surface topography and μ‐roughness; the results show an increase in roughness with pH similar to that observed experimentally.« less

Authors:
ORCiD logo [1];  [1];  [1];  [1];  [1];  [1];  [1];  [1];  [1]
  1. Lawrence Livermore National Laboratory Livermore California
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1401770
Grant/Contract Number:  
DE‐AC52‐07NA27344
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of the American Ceramic Society
Additional Journal Information:
Journal Name: Journal of the American Ceramic Society Journal Volume: 100 Journal Issue: 7; Journal ID: ISSN 0002-7820
Publisher:
Wiley-Blackwell
Country of Publication:
United States
Language:
English

Citation Formats

Suratwala, Tayyab, Steele, William, Feit, Michael, Shen, Nan, Wong, Lana, Dylla‐Spears, Rebecca, Desjardin, Richard, Elhadj, Selim, and Miller, Phil. Relationship between surface μ‐roughness and interface slurry particle spatial distribution during glass polishing. United States: N. p., 2017. Web. doi:10.1111/jace.14820.
Suratwala, Tayyab, Steele, William, Feit, Michael, Shen, Nan, Wong, Lana, Dylla‐Spears, Rebecca, Desjardin, Richard, Elhadj, Selim, & Miller, Phil. Relationship between surface μ‐roughness and interface slurry particle spatial distribution during glass polishing. United States. https://doi.org/10.1111/jace.14820
Suratwala, Tayyab, Steele, William, Feit, Michael, Shen, Nan, Wong, Lana, Dylla‐Spears, Rebecca, Desjardin, Richard, Elhadj, Selim, and Miller, Phil. Mon . "Relationship between surface μ‐roughness and interface slurry particle spatial distribution during glass polishing". United States. https://doi.org/10.1111/jace.14820.
@article{osti_1401770,
title = {Relationship between surface μ‐roughness and interface slurry particle spatial distribution during glass polishing},
author = {Suratwala, Tayyab and Steele, William and Feit, Michael and Shen, Nan and Wong, Lana and Dylla‐Spears, Rebecca and Desjardin, Richard and Elhadj, Selim and Miller, Phil},
abstractNote = {Abstract During optical glass polishing, a number of interactions between the workpiece (i.e., glass), polishing slurry, and pad can influence the resulting workpiece roughness at different spatial scale lengths. In our previous studies, the particle size distribution of the slurry, the pad topography, and the amount of material removed by a single particle on the workpiece were shown to strongly correlate with roughness at AFM scale lengths (nm‐μm) and weakly at μ‐roughness scale lengths (μm‐mm). In this study, the polishing slurry pH and the generation of glass removal products are shown to influence the slurry particle spatial and height distribution at the polishing interface and the resulting μ‐roughness of the glass workpiece. A series of fused silica and phosphate glass samples were polished with various ceria and colloidal silica slurries over a range of slurry pH , and the resulting AFM roughness and μ‐roughness were measured. The AFM roughness was largely invariant with pH , suggesting that the removal function of a single particle is unchanged with pH . However, the μ‐roughness changed significantly, increasing linearly with pH for phosphate glass and having a maximum at an intermediate pH for fused silica. In addition, the spatial and height distribution of slurry particles on the pad (as measured by laser confocal microscopy) was determined to be distinctly different at low and high pH during phosphate glass polishing. Also, the zeta potential as a function of pH was measured for the workpiece, slurry, and pad with and without surrogate glass products (K 3 PO 4 for phosphate glass and Si( OH ) 4 for silica) to assess the role of interfacial charge during polishing. The addition of K 3 PO 4 significantly raised the zeta potential, whereas addition of Si( OH ) 4 had little effect on the zeta potential. An electrostatic DLVO three‐body force model, using the measured zeta potentials, was used to calculate the particle–particle, particle–workpiece, and particle–pad attractive and repulsive forces as a function of pH and the incorporation of glass products at the interface. The model predicted an increase in particle–pad attraction with an increase in pH and phosphate glass products consistent with the measured slurry distribution on the pads during phosphate glass polishing. Finally, a slurry “island” distribution gap ( IDG ) model has been formulated which utilizes the measured interface slurry distributions and a load balance to determine the interface gap, the contact area fraction, and the load on each slurry “island”. The IDG model was then used to simulate the workpiece surface topography and μ‐roughness; the results show an increase in roughness with pH similar to that observed experimentally.},
doi = {10.1111/jace.14820},
journal = {Journal of the American Ceramic Society},
number = 7,
volume = 100,
place = {United States},
year = {Mon Apr 03 00:00:00 EDT 2017},
month = {Mon Apr 03 00:00:00 EDT 2017}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1111/jace.14820

Citation Metrics:
Cited by: 13 works
Citation information provided by
Web of Science

Save / Share:

Works referenced in this record:

Experimental investigation on mechanisms of silicon chemical mechanical polishing
journal, April 2004


Mechanism and Simulation of Removal Rate and Surface Roughness During Optical Polishing of Glasses
journal, March 2016

  • Suratwala, Tayyab; Steele, William; Feit, Michael
  • Journal of the American Ceramic Society, Vol. 99, Issue 6
  • DOI: 10.1111/jace.14220

Chemical processes in glass polishing
journal, April 1990


Charged micelle halo mechanism for agglomeration reduction in metal oxide particle based polishing slurries
journal, April 2014

  • Dylla-Spears, Rebecca; Wong, Lana; Miller, Philip E.
  • Colloids and Surfaces A: Physicochemical and Engineering Aspects, Vol. 447
  • DOI: 10.1016/j.colsurfa.2014.01.061

Mutual coagulation of colloidal dispersions
journal, January 1966

  • Hogg, R.; Healy, T. W.; Fuerstenau, D. W.
  • Transactions of the Faraday Society, Vol. 62
  • DOI: 10.1039/tf9666201638

Nanoscratching of Optical Glass Surfaces Near the Elastic–Plastic Load Boundary to Mimic the Mechanics of Polishing Particles
journal, January 2016

  • Shen, Nan; Suratwala, Tayyab; Steele, William
  • Journal of the American Ceramic Society, Vol. 99, Issue 5
  • DOI: 10.1111/jace.14083

Toward Deterministic Material Removal and Surface Figure During Fused Silica Pad Polishing
journal, February 2010


Large Optics for the National Ignition Facility
journal, February 2016

  • Baisden, P. A.; Atherton, L. J.; Hawley, R. A.
  • Fusion Science and Technology, Vol. 69, Issue 1
  • DOI: 10.13182/FST15-143

Microscopic Removal Function and the Relationship Between Slurry Particle Size Distribution and Workpiece Roughness During Pad Polishing
journal, November 2013

  • Suratwala, Tayyab; Feit, Michael; Steele, William
  • Journal of the American Ceramic Society, Vol. 97, Issue 1
  • DOI: 10.1111/jace.12631

Effect of pH on ceria–silica interactions during chemical mechanical polishing
journal, May 2005

  • Abiade, Jeremiah T.; Choi, Wonseop; Singh, Rajiv K.
  • Journal of Materials Research, Vol. 20, Issue 5
  • DOI: 10.1557/JMR.2005.0176

Slurry particle size evolution during the polishing of optical glass
journal, January 1995

  • Cumbo, M. J.; Fairhurst, D.; Jacobs, S. D.
  • Applied Optics, Vol. 34, Issue 19
  • DOI: 10.1364/AO.34.003743

Convergent Pad Polishing of Amorphous Silica
journal, February 2012


Influence of Temperature and Material Deposit on Material Removal Uniformity during Optical Pad Polishing
journal, May 2014

  • Suratwala, Tayyab; Feit, Michael D.; Steele, William A.
  • Journal of the American Ceramic Society, Vol. 97, Issue 6
  • DOI: 10.1111/jace.12969

Cerium Oxide Slurries in CMP. Electrophoretic Mobility and Adsorption Investigations of Ceria/Silicate Interaction
journal, January 2004

  • Suphantharida, Preuchsuda; Osseo-Asare, Kwadwo
  • Journal of The Electrochemical Society, Vol. 151, Issue 10
  • DOI: 10.1149/1.1785793