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Title: Comparison of dielectric properties of additively manufactured vs. solvent cast polyimide dielectrics

The permittivity, dielectric loss, and DC dielectric breakdown strength of additively manufactured, solvent-cast, and commercial polyimide films are reported As expected, commercial films performed better than both AM and solvent-cast lab-made films. Solvent-cast films generally performed better than AM films, although performance depended on the optimization of the material for the specific deposition technique. The most significant degradation of performance in all the lab-made films was in the dispersion of both the x/Df measurements and the dielectric breakdown strength (Weibull β). Commercial films had a breakdown strength of 4891 kV/cm and β = 13.0 whereas the highest performing lab-made films had a breakdown strength of 4072 kV/cm and β = 3.8. Furthermore, this increase in dispersion in all the lab-made samples is attributed to higher variability in the preparation, a higher defect level related to fabrication in the lab environment and, for some AM samples, to morphology/topology features resulting from the deposition technique.
Authors:
 [1] ;  [1] ;  [1]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Publication Date:
Report Number(s):
SAND-2016-6113J
642750
Grant/Contract Number:
AC04-94AL85000
Type:
Accepted Manuscript
Journal Name:
IEEE Transactions on Dielectrics and Electrical Insulation
Additional Journal Information:
Journal Name: IEEE Transactions on Dielectrics and Electrical Insulation
Research Org:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; films; electrodes; solvents; permittivity; dielectrics; polyimides; dielectric breakdown
OSTI Identifier:
1344474