Thermal conductance measurements of bolted copper joints for SuperCDMS

Journal Article · Tue Apr 28 04:00:00 UTC 2015 · Cryogenics

DOI: https://doi.org/10.1016/j.cryogenics.2015.04.006 · OSTI ID:1253011

Schmitt, R. L. ^[1]; Tatkowski, G. ^[1]; Ruschman, M. ^[1]; Golwala, S. ^[2]; Kellaris, N. ^[3]; Daal, M. ^[3]; Hall, J. ^[4]; Hoppe, E. W. ^[4]

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1. Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
2. California Inst. of Technology (CalTech), Pasadena, CA (United States)
3. Univ. of California, Berkeley, CA (United States)
4. Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Finally, the results we obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

• Research Organization: Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States); Pacific Northwest National Laboratory (PNNL), Richland, WA (United States)
• Sponsoring Organization: USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
• Contributing Organization: SuperCDMS
• Grant/Contract Number: AC02-07CH11359
• OSTI ID: 1253011
• Report Number(s): FERMILAB-PUB--14-522-PPD; 1402733
• Journal Information: Cryogenics, Journal Name: Cryogenics Vol. 70; ISSN 0011-2275
• Publisher: ElsevierCopyright Statement
• Country of Publication: United States
• Language: English