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Title: Low Speed Crack Propagation via Kink Formation and Advance on the Silicon (110) Cleavage Plane

Journal Article · · Physical Review Letters

Not Available

Sponsoring Organization:
USDOE
Grant/Contract Number:
AC02-06CH11357
OSTI ID:
1227321
Journal Information:
Physical Review Letters, Journal Name: Physical Review Letters Journal Issue: 13 Vol. 115; ISSN 0031-9007; ISSN PRLTAO
Publisher:
American Physical SocietyCopyright Statement
Country of Publication:
United States
Language:
English

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