Induction soldering of photovoltaic system components
Abstract
A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.
- Inventors:
- Issue Date:
- Research Org.:
- SunPower Corporation, San Jose, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1226546
- Patent Number(s):
- 9186741
- Application Number:
- 12/558,095
- Assignee:
- SunPower Corporation (San Jose, CA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- FC36-07GO17043
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2009 Sep 11
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 14 SOLAR ENERGY
Citation Formats
Kumaria, Shashwat, and de Leon, Briccio. Induction soldering of photovoltaic system components. United States: N. p., 2015.
Web.
Kumaria, Shashwat, & de Leon, Briccio. Induction soldering of photovoltaic system components. United States.
Kumaria, Shashwat, and de Leon, Briccio. Tue .
"Induction soldering of photovoltaic system components". United States. https://www.osti.gov/servlets/purl/1226546.
@article{osti_1226546,
title = {Induction soldering of photovoltaic system components},
author = {Kumaria, Shashwat and de Leon, Briccio},
abstractNote = {A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 17 00:00:00 EST 2015},
month = {Tue Nov 17 00:00:00 EST 2015}
}
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