Method & apparatus for monitoring plasma processing operations
Abstract
The invention generally relates to various aspects of a plasma process and, more specifically, to the monitoring of such plasma processes. One aspect relates to a plasma monitoring module that may be adjusted in at least some manner so as to re-evaluate a previously monitored plasma process. For instance, optical emissions data on a plasma process that was previously monitored by the plasma monitoring module may be replayed through the plasma monitoring module after making at least one adjustment in relation to the plasma monitoring module.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175081
- Patent Number(s):
- 6805810
- Application Number:
- 10/108,193
- Assignee:
- Sandia Corporation
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01J - MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Smith, Jr., Michael Lane, Ward, Pamela Denise, and Stevenson, Joel O'Don. Method & apparatus for monitoring plasma processing operations. United States: N. p., 2004.
Web.
Smith, Jr., Michael Lane, Ward, Pamela Denise, & Stevenson, Joel O'Don. Method & apparatus for monitoring plasma processing operations. United States.
Smith, Jr., Michael Lane, Ward, Pamela Denise, and Stevenson, Joel O'Don. Tue .
"Method & apparatus for monitoring plasma processing operations". United States. https://www.osti.gov/servlets/purl/1175081.
@article{osti_1175081,
title = {Method & apparatus for monitoring plasma processing operations},
author = {Smith, Jr., Michael Lane and Ward, Pamela Denise and Stevenson, Joel O'Don},
abstractNote = {The invention generally relates to various aspects of a plasma process and, more specifically, to the monitoring of such plasma processes. One aspect relates to a plasma monitoring module that may be adjusted in at least some manner so as to re-evaluate a previously monitored plasma process. For instance, optical emissions data on a plasma process that was previously monitored by the plasma monitoring module may be replayed through the plasma monitoring module after making at least one adjustment in relation to the plasma monitoring module.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 19 00:00:00 EDT 2004},
month = {Tue Oct 19 00:00:00 EDT 2004}
}
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Works referenced in this record:
Process uniformity for plasma etchback and desmear in printed wiring board manufacturing
report, August 1996
- Ward, P. P.; Smith, M. L.; Stevenson, J. O.