Glass composition and process for sealing void spaces in electrochemical devices
Abstract
A glass foaming material and method are disclosed for filling void spaces in electrochemical devices. The glass material includes a reagent that foams at a temperature above the softening point of the glass. Expansion of the glass fills void spaces including by-pass and tolerance channels of electrochemical devices. In addition, cassette to cassette seals can also be formed while channels and other void spaces are filled, reducing the number of processing steps needed.
- Inventors:
-
- Richland, WA
- Kennewick, WA
- Issue Date:
- Research Org.:
- Pacific Northwest National Laboratory (PNNL), Richland, WA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1044071
- Patent Number(s):
- 8166777
- Application Number:
- 12/729,096
- Assignee:
- Battelle Memorial Institute (Richland, WA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C03 - GLASS C03C - CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01M - PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- DOE Contract Number:
- AC05-76RL01830
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Meinhardt, Kerry D, and Kirby, Brent W. Glass composition and process for sealing void spaces in electrochemical devices. United States: N. p., 2012.
Web.
Meinhardt, Kerry D, & Kirby, Brent W. Glass composition and process for sealing void spaces in electrochemical devices. United States.
Meinhardt, Kerry D, and Kirby, Brent W. Tue .
"Glass composition and process for sealing void spaces in electrochemical devices". United States. https://www.osti.gov/servlets/purl/1044071.
@article{osti_1044071,
title = {Glass composition and process for sealing void spaces in electrochemical devices},
author = {Meinhardt, Kerry D and Kirby, Brent W},
abstractNote = {A glass foaming material and method are disclosed for filling void spaces in electrochemical devices. The glass material includes a reagent that foams at a temperature above the softening point of the glass. Expansion of the glass fills void spaces including by-pass and tolerance channels of electrochemical devices. In addition, cassette to cassette seals can also be formed while channels and other void spaces are filled, reducing the number of processing steps needed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 01 00:00:00 EDT 2012},
month = {Tue May 01 00:00:00 EDT 2012}
}
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