skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Multilayer compressive seal for sealing in high temperature devices

Abstract

A mica based compressive seal has been developed exhibiting superior thermal cycle stability when compared to other compressive seals known in the art. The seal is composed of compliant glass or metal interlayers and a sealing (gasket) member layer composed of mica that is infiltrated with a glass forming material, which effectively reduces leaks within the seal. The compressive seal shows approximately a 100-fold reduction in leak rates compared with previously developed hybrid seals after from 10 to about 40 thermal cycles under a compressive stress of from 50 psi to 100 psi at temperatures in the range from 600.degree. C. to about 850.degree. C.

Inventors:
 [1];  [1]
  1. Richland, WA
Issue Date:
Research Org.:
Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
913427
Patent Number(s):
7258942
Application Number:
10/656,300
Assignee:
Battelle Memorial Institute (Richland, WA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01M - PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
DOE Contract Number:  
AC06-76RL01830
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chou, Yeong-Shyung, and Stevenson, Jeffry W. Multilayer compressive seal for sealing in high temperature devices. United States: N. p., 2007. Web.
Chou, Yeong-Shyung, & Stevenson, Jeffry W. Multilayer compressive seal for sealing in high temperature devices. United States.
Chou, Yeong-Shyung, and Stevenson, Jeffry W. Tue . "Multilayer compressive seal for sealing in high temperature devices". United States. https://www.osti.gov/servlets/purl/913427.
@article{osti_913427,
title = {Multilayer compressive seal for sealing in high temperature devices},
author = {Chou, Yeong-Shyung and Stevenson, Jeffry W},
abstractNote = {A mica based compressive seal has been developed exhibiting superior thermal cycle stability when compared to other compressive seals known in the art. The seal is composed of compliant glass or metal interlayers and a sealing (gasket) member layer composed of mica that is infiltrated with a glass forming material, which effectively reduces leaks within the seal. The compressive seal shows approximately a 100-fold reduction in leak rates compared with previously developed hybrid seals after from 10 to about 40 thermal cycles under a compressive stress of from 50 psi to 100 psi at temperatures in the range from 600.degree. C. to about 850.degree. C.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {8}
}

Patent:

Save / Share:

Works referenced in this record:

Compressive mica seals for SOFC applications
journal, December 2001


Thermal cycling and degradation mechanisms of compressive mica-based seals for solid oxide fuel cells
journal, November 2002