Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate
Abstract
Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.
- Inventors:
-
- St. Charles, MO
- Manchester, MO
- Olivette, MO
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 879449
- Patent Number(s):
- 5975410
- Application Number:
- 08/921582
- Assignee:
- McDonnell Douglas Corporation (St. Louis, MO)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
G - PHYSICS G21 - NUCLEAR PHYSICS G21B - FUSION REACTORS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Slattery, Kevin T, Driemeyer, Daniel E, Wille,, and Gerald, W. Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate. United States: N. p., 1999.
Web.
Slattery, Kevin T, Driemeyer, Daniel E, Wille,, & Gerald, W. Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate. United States.
Slattery, Kevin T, Driemeyer, Daniel E, Wille,, and Gerald, W. Tue .
"Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate". United States. https://www.osti.gov/servlets/purl/879449.
@article{osti_879449,
title = {Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate},
author = {Slattery, Kevin T and Driemeyer, Daniel E and Wille, and Gerald, W},
abstractNote = {Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {11}
}
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