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Title: Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate

Abstract

Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.

Inventors:
 [1];  [2]; ;  [3]
  1. St. Charles, MO
  2. Manchester, MO
  3. Olivette, MO
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
879449
Patent Number(s):
5975410
Application Number:
08/921582
Assignee:
McDonnell Douglas Corporation (St. Louis, MO)
Patent Classifications (CPCs):
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Slattery, Kevin T, Driemeyer, Daniel E, Wille,, and Gerald, W. Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate. United States: N. p., 1999. Web.
Slattery, Kevin T, Driemeyer, Daniel E, Wille,, & Gerald, W. Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate. United States.
Slattery, Kevin T, Driemeyer, Daniel E, Wille,, and Gerald, W. Tue . "Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate". United States. https://www.osti.gov/servlets/purl/879449.
@article{osti_879449,
title = {Process Of Bonding A Metal Brush Structure To A Planar Surface Of A Metal Substrate},
author = {Slattery, Kevin T and Driemeyer, Daniel E and Wille, and Gerald, W},
abstractNote = {Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {11}
}

Patent:

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