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Title: Apparatus for improving performance of electrical insulating structures

Abstract

Removing the electrical field from the internal volume of high-voltage structures; e.g., bushings, connectors, capacitors, and cables. The electrical field is removed from inherently weak regions of the interconnect, such as between the center conductor and the solid dielectric, and places it in the primary insulation. This is accomplished by providing a conductive surface on the inside surface of the principal solid dielectric insulator surrounding the center conductor and connects the center conductor to this conductive surface. The advantage of removing the electric fields from the weaker dielectric region to a stronger area improves reliability, increases component life and operating levels, reduces noise and losses, and allows for a smaller compact design. This electric field control approach is currently possible on many existing products at a modest cost. Several techniques are available to provide the level of electric field control needed. Choosing the optimum technique depends on material, size, and surface accessibility. The simplest deposition method uses a standard electroless plating technique, but other metalization techniques include vapor and energetic deposition, plasma spraying, conductive painting, and other controlled coating methods.

Inventors:
 [1];  [2]
  1. (Modesto, CA)
  2. (Brentwood, CA)
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
874203
Patent Number(s):
6339195
Assignee:
The Regents of the University of California (Oakland, CA) LLNL
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
apparatus; improving; performance; electrical; insulating; structures; removing; field; internal; volume; high-voltage; bushings; connectors; capacitors; cables; removed; inherently; weak; regions; interconnect; center; conductor; solid; dielectric; primary; insulation; accomplished; providing; conductive; surface; inside; principal; insulator; surrounding; connects; advantage; electric; fields; weaker; region; stronger; improves; reliability; increases; component; life; operating; levels; reduces; noise; losses; allows; compact; design; control; approach; currently; existing; products; modest; cost; techniques; available; provide; level; choosing; optimum; technique; depends; material; size; accessibility; simplest; deposition; method; standard; electroless; plating; metalization; vapor; energetic; plasma; spraying; painting; controlled; coating; methods; electric field; inside surface; plasma spray; internal volume; improving performance; /174/

Citation Formats

Wilson, Michael J., and Goerz, David A. Apparatus for improving performance of electrical insulating structures. United States: N. p., 2002. Web.
Wilson, Michael J., & Goerz, David A. Apparatus for improving performance of electrical insulating structures. United States.
Wilson, Michael J., and Goerz, David A. Tue . "Apparatus for improving performance of electrical insulating structures". United States. https://www.osti.gov/servlets/purl/874203.
@article{osti_874203,
title = {Apparatus for improving performance of electrical insulating structures},
author = {Wilson, Michael J. and Goerz, David A.},
abstractNote = {Removing the electrical field from the internal volume of high-voltage structures; e.g., bushings, connectors, capacitors, and cables. The electrical field is removed from inherently weak regions of the interconnect, such as between the center conductor and the solid dielectric, and places it in the primary insulation. This is accomplished by providing a conductive surface on the inside surface of the principal solid dielectric insulator surrounding the center conductor and connects the center conductor to this conductive surface. The advantage of removing the electric fields from the weaker dielectric region to a stronger area improves reliability, increases component life and operating levels, reduces noise and losses, and allows for a smaller compact design. This electric field control approach is currently possible on many existing products at a modest cost. Several techniques are available to provide the level of electric field control needed. Choosing the optimum technique depends on material, size, and surface accessibility. The simplest deposition method uses a standard electroless plating technique, but other metalization techniques include vapor and energetic deposition, plasma spraying, conductive painting, and other controlled coating methods.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

Patent:

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