skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Method for making surfactant-templated, high-porosity thin films

Abstract

An evaporation-induced self-assembly method to prepare a surfactant-templated thin film by mixing a silica sol, a surfactant, and a hydrophobic polymer and then evaporating a portion of the solvent during coating onto a substrate and then heating to form a liquid-phase, thin film material with a porosity greater than approximately 50 percent. The high porosity thin films can have dielectric constants less than 2 to be suitable for applications requiring low-dielectric constants. An interstitial compound can be added to the mixture, with the interstitial compound either covalently bonded to the pores or physically entrapped within the porous structure. The selection of the interstitial compound provides a means for developing thin films for applications including membranes, sensors, low dielectric constant films, photonic materials and optical hosts.

Inventors:
 [1];  [2];  [1]
  1. (Albuquerque, NM)
  2. (San Jose, CA)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
873911
Patent Number(s):
6270846
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; surfactant-templated; high-porosity; films; evaporation-induced; self-assembly; prepare; film; mixing; silica; sol; surfactant; hydrophobic; polymer; evaporating; portion; solvent; coating; substrate; heating; form; liquid-phase; material; porosity; approximately; 50; percent; dielectric; constants; suitable; applications; requiring; low-dielectric; interstitial; compound; added; mixture; covalently; bonded; pores; physically; entrapped; porous; structure; selection; provides; means; developing; including; membranes; sensors; constant; photonic; materials; optical; hosts; dielectric constants; silica sol; applications including; applications requiring; dielectric constant; porous structure; film material; covalently bonded; hydrophobic polymer; including membrane; /427/

Citation Formats

Brinker, C. Jeffrey, Lu, Yunfeng, and Fan, Hongyou. Method for making surfactant-templated, high-porosity thin films. United States: N. p., 2001. Web.
Brinker, C. Jeffrey, Lu, Yunfeng, & Fan, Hongyou. Method for making surfactant-templated, high-porosity thin films. United States.
Brinker, C. Jeffrey, Lu, Yunfeng, and Fan, Hongyou. Mon . "Method for making surfactant-templated, high-porosity thin films". United States. https://www.osti.gov/servlets/purl/873911.
@article{osti_873911,
title = {Method for making surfactant-templated, high-porosity thin films},
author = {Brinker, C. Jeffrey and Lu, Yunfeng and Fan, Hongyou},
abstractNote = {An evaporation-induced self-assembly method to prepare a surfactant-templated thin film by mixing a silica sol, a surfactant, and a hydrophobic polymer and then evaporating a portion of the solvent during coating onto a substrate and then heating to form a liquid-phase, thin film material with a porosity greater than approximately 50 percent. The high porosity thin films can have dielectric constants less than 2 to be suitable for applications requiring low-dielectric constants. An interstitial compound can be added to the mixture, with the interstitial compound either covalently bonded to the pores or physically entrapped within the porous structure. The selection of the interstitial compound provides a means for developing thin films for applications including membranes, sensors, low dielectric constant films, photonic materials and optical hosts.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}

Patent:

Save / Share: