Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material
Abstract
Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties. 6 figs.
- Inventors:
- Issue Date:
- Sponsoring Org.:
- USDOE; USDOE, Washington, DC (United States)
- OSTI Identifier:
- 6439335
- Patent Number(s):
- 5925228
- Application Number:
- PPN: US 8-781069
- Assignee:
- Sandia Corp., Albuquerque, NM (United States)
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 9 Jan 1997
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; CERAMICS; COATINGS; COMPOSITE MATERIALS; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTROPHORESIS; SEMICONDUCTOR MATERIALS; SOL-GEL PROCESS; ELECTRICAL PROPERTIES; MATERIALS; PHYSICAL PROPERTIES; 360601* - Other Materials- Preparation & Manufacture
Citation Formats
Panitz, J K, Reed, S T, Ashley, C S, Neiser, R A, and Moffatt, W C. Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material. United States: N. p., 1999.
Web.
Panitz, J K, Reed, S T, Ashley, C S, Neiser, R A, & Moffatt, W C. Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material. United States.
Panitz, J K, Reed, S T, Ashley, C S, Neiser, R A, and Moffatt, W C. Tue .
"Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material". United States.
@article{osti_6439335,
title = {Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material},
author = {Panitz, J K and Reed, S T and Ashley, C S and Neiser, R A and Moffatt, W C},
abstractNote = {Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties. 6 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {7}
}
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