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Title: Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material

Abstract

Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties. 6 figs.

Inventors:
; ; ; ;
Issue Date:
Sponsoring Org.:
USDOE; USDOE, Washington, DC (United States)
OSTI Identifier:
6439335
Patent Number(s):
5925228
Application Number:
PPN: US 8-781069
Assignee:
Sandia Corp., Albuquerque, NM (United States)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 9 Jan 1997
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; CERAMICS; COATINGS; COMPOSITE MATERIALS; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTROPHORESIS; SEMICONDUCTOR MATERIALS; SOL-GEL PROCESS; ELECTRICAL PROPERTIES; MATERIALS; PHYSICAL PROPERTIES; 360601* - Other Materials- Preparation & Manufacture

Citation Formats

Panitz, J K, Reed, S T, Ashley, C S, Neiser, R A, and Moffatt, W C. Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material. United States: N. p., 1999. Web.
Panitz, J K, Reed, S T, Ashley, C S, Neiser, R A, & Moffatt, W C. Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material. United States.
Panitz, J K, Reed, S T, Ashley, C S, Neiser, R A, and Moffatt, W C. Tue . "Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material". United States.
@article{osti_6439335,
title = {Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material},
author = {Panitz, J K and Reed, S T and Ashley, C S and Neiser, R A and Moffatt, W C},
abstractNote = {Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties. 6 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {7}
}